Abstract: Disclosed herein are systems and methods for treating a magnesium or a magnesium alloy substrate. The system includes a cleaning composition having a pH greater than 8.5 or a solvent, and a pretreatment composition comprising an organophosphate compound and/or an organophosphonate compound. The method includes contacting a substrate surface with the cleaning composition or the solvent, and contacting the surface with the pretreatment composition. Also disclosed are substrates treated with one of the systems or methods. Also disclosed are magnesium or magnesium alloy substrates wherein, between the air/substrate interface and 500 nm below the air/substrate interface (a) oxygen and magnesium are present in a combined amount of at least 70 atomic %; (b) carbon is present in an amount of no more than 30 atomic %; and/or (c) fluoride is present in an amount of no more than 8 atomic %, wherein atomic % is measured by XPS depth profiling.

Abstract: A method for controlling a digital projector by sensing a condition of a switched power outlet and determining and performing at least one programmed response to the sensed condition. Also, a digital projector interface having a switched outlet interface for receiving a signal indicating a condition a switched power outlet and a processor coupled to the switched outlet interface. Processes implemented by the processor are responsive to the switched outlet condition to perform a preselected function involving a digital projector in response to the switched outlet condition.

Abstract: An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.

Abstract: A high speed, high density electrical connector for use with printed circuit boards is described. The connector is in two pieces, each piece including columns of signal contacts and shield plates which interconnect when the two pieces are mated. The shield plates are disposed in each piece of the connector such that, when mated, the shield plates are substantially perpendicular to the shield plates in the other piece of the connector. The shields have a grounding arrangement that is adapted to control the electromagnetic fields for various system architectures, simultaneous switching configurations and signal speeds. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer.

Abstract: An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.

Abstract: A storage system is provided for the rear storage compartment of a vehicle. The storage system may include a collapsible cart that is received in tracks in a load floor. Other types of objects may be stored on the load floor or in compartments below the load floor. Compartments may be provided below the load floor on a tray having multiple compartments that is rotatable within a well formed under the load floor. A frame for storing removable trays, bins or the collapsible cart may be used to store objects above the load floor.

Abstract: A high speed, high density electrical connector for use with printed circuit boards is described. The connector is in two pieces, each piece including columns of signal contacts and shield plates which interconnect when the two pieces are mated. The shield plates are disposed in each piece of the connector such that, when mated, the shield plates are substantially perpendicular to the shield plates in the other piece of the connector. The shields have a grounding arrangement that is adapted to control the electromagnetic fields for various system architectures, simultaneous switching configurations and signal speeds. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer.

Abstract: A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields.

Abstract: A high speed, high density electrical connector for use with printed circuit boards. The connector is in two pieces with one piece having pins and shield plates and the other having socket type signal contacts and shield plates. The shields have a grounding arrangement which is adapted to control the electromagnetic fields, for various system architectures, simultaneous switching configurations and signal speeds, allowing all of the socket type signal contacts to be used for signal transmission. Additionally, at least one piece of the connector is manufactured from wafers, with each ground plane and signal column injection molded into components which, when combined, form a wafer. This construction allows very close spacing between adjacent columns of signal contacts as well as tightly controlled spacing between the signal contacts and the shields.

Abstract: An electrical connector assembly used with a daughter board and a back plane that protects the daughter board and the electrical connectors from damage during use. The assembly includes mounting hardware that is attached to the daughter board to prevent it from bending when a high insertion force is used to plug the daughter board onto the back plane. The mounting hardware also prevents the electrical connectors from damage by distributing the insertion force evenly across the connectors. The assembly also includes a protective cover that is attached to the electrical connectors. The protective cover encloses the signal contacts of the electrical connectors that are attached to the daughter board, and swings away automatically to expose the signal contacts when the daughter board is plugged onto the back plane.