Patents by Inventor Steven J. Dean

Steven J. Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250133695
    Abstract: A flow-through folding membrane accumulator comprises a hollow cylindrical housing and a folding flexible membrane disposed in an interior volume of the housing. The membrane defines an interior liquid channel extending through the membrane along a longitudinal axis, and liquid coolant flows from an inlet of the accumulator through the interior liquid channel to an outlet of the accumulator. The membrane is sealed to the housing such that an air-tight cavity filled with a gas is formed between the housing and the membrane. The cavity radially surrounds the internal liquid channel, with the membrane separating the cavity and the internal liquid channel. Volumes of the cavity and channel change in response to deformation of the membrane and based on pressures of the liquid coolant. The membrane may comprise multiple folds extending parallel to the longitudinal axis and distributed circumferentially around the axis.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 24, 2025
    Inventors: Michael Dustin Scott, Steven J. Dean, Harvey John Lunsman
  • Publication number: 20250012296
    Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.
    Type: Application
    Filed: September 17, 2024
    Publication date: January 9, 2025
    Inventors: John P. Franz, Steven J. Dean, Ernesto J. Ferrer
  • Patent number: 12104618
    Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.
    Type: Grant
    Filed: October 31, 2022
    Date of Patent: October 1, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: John P. Franz, Steven J. Dean, Ernesto J. Ferrer
  • Publication number: 20240306352
    Abstract: A process includes communicating a coolant flow between an inlet and an outlet of a coolant subsystem that is associated with a cooling domain to remove thermal energy from a plurality of processor-based nodes of the cooling domain. The communication of the coolant flow has associated predefined parameters. The process includes regulating a temperature of the coolant flow at the outlet. In accordance with example implementations, the regulation includes determining, based on the predefined parameters, a minimum collective power consumption by the processor-based nodes to maintain a temperature of the coolant flow at the outlet at or above a minimum threshold temperature, and based on the minimum power consumption, scheduling jobs to be executed by the nodes.
    Type: Application
    Filed: March 8, 2023
    Publication date: September 12, 2024
    Inventors: Torsten Wilde, Rob J. Rongstad, Peter A. Hansen, Robert E. Mascia, Steven J. Martin, Steven J. Dean, Harvey E. White, JR., Brian T. Purcell
  • Publication number: 20240141926
    Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 2, 2024
    Inventors: John P. FRANZ, Steven J. DEAN, Ernesto J. FERRER
  • Patent number: 10941892
    Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.
    Type: Grant
    Filed: October 20, 2017
    Date of Patent: March 9, 2021
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Michael Scott, Steven J. Dean, Harvey J. Lunsman
  • Patent number: 10521260
    Abstract: A high performance computing (HPC) system has an architecture that separates data paths used by compute nodes exchanging computational data from the data paths used by compute nodes to obtain computational work units and save completed computations. The system enables an improved method of saving checkpoint data, and an improved method of using an analysis of the saved data to assign particular computational work units to particular compute nodes. The system includes a compute fabric and compute nodes that cooperatively perform a computation by mutual communication using the compute fabric. The system also includes a local data fabric that is coupled to the compute nodes, a memory, and a data node. The data node is configured to retrieve data for the computation from an external bulk data storage, and to store its work units in the memory for access by the compute nodes.
    Type: Grant
    Filed: July 14, 2017
    Date of Patent: December 31, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Steven J. Dean, Michael Woodacre, Randal S. Passint, Eric C. Fromm, Thomas E. McGee, Michael E. Malewicki, Kirill Malkin
  • Patent number: 10237999
    Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: March 19, 2019
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Harvey Lunsman, Troy Oxby, Michael Peterson, David Collins, Steven J. Dean, Russell Stacy, Andy Warner
  • Patent number: 10188016
    Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.
    Type: Grant
    Filed: October 31, 2016
    Date of Patent: January 22, 2019
    Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
    Inventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
  • Publication number: 20180238480
    Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.
    Type: Application
    Filed: October 20, 2017
    Publication date: August 23, 2018
    Inventors: Michael Scott, Steven J. Dean, Harvey J. Lunsman
  • Publication number: 20180018196
    Abstract: A high performance computing (HPC) system has an architecture that separates data paths used by compute nodes exchanging computational data from the data paths used by compute nodes to obtain computational work units and save completed computations. The system enables an improved method of saving checkpoint data, and an improved method of using an analysis of the saved data to assign particular computational work units to particular compute nodes. The system includes a compute fabric and compute nodes that cooperatively perform a computation by mutual communication using the compute fabric. The system also includes a local data fabric that is coupled to the compute nodes, a memory, and a data node. The data node is configured to retrieve data for the computation from an external bulk data storage, and to store its work units in the memory for access by the compute nodes.
    Type: Application
    Filed: July 14, 2017
    Publication date: January 18, 2018
    Inventors: Steven J. Dean, Michael Woodacre, Randal S. Passint, Eric C. Fromm, Thomas E. McGee, Michael E. Malewicki, Kirill Malkin
  • Patent number: 9811127
    Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: November 7, 2017
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Steven J. Dean, Roger Ramseier, Mark Maloney, David R. Collins
  • Publication number: 20170127575
    Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Inventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
  • Publication number: 20170127549
    Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space.
    Type: Application
    Filed: October 31, 2016
    Publication date: May 4, 2017
    Inventors: Harvey Lunsman, Troy Oxby, Michael Peterson, David Collins, Steven J. Dean, Russell Stacy, Andy Warner
  • Patent number: 9606588
    Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: March 28, 2017
    Assignee: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, David R. Collins, Timothy Scott McCann, Perry D. Franz, Jeffrey M. Glanzman
  • Patent number: 9229497
    Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: January 5, 2016
    Assignee: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
  • Patent number: 9128682
    Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.
    Type: Grant
    Filed: July 24, 2013
    Date of Patent: September 8, 2015
    Assignee: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Robert E. Mascia, Harvey J. Lunsman, Michael Kubisiak, David R. Collins, Timothy S. McCann
  • Publication number: 20140126142
    Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 8, 2014
    Inventors: Steven J. Dean, Roger Ramseier, Mark Maloney, David R. Collins
  • Publication number: 20140126141
    Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 8, 2014
    Applicant: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
  • Publication number: 20140126143
    Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.
    Type: Application
    Filed: July 24, 2013
    Publication date: May 8, 2014
    Applicant: Silicon Graphics International Corp.
    Inventors: Steven J. Dean, Robert E. Mascia, Harvey J. Lunsman, Michael Kubisiak, David R. Collins, Timothy S. McCann