Patents by Inventor Steven J. Dean
Steven J. Dean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250133695Abstract: A flow-through folding membrane accumulator comprises a hollow cylindrical housing and a folding flexible membrane disposed in an interior volume of the housing. The membrane defines an interior liquid channel extending through the membrane along a longitudinal axis, and liquid coolant flows from an inlet of the accumulator through the interior liquid channel to an outlet of the accumulator. The membrane is sealed to the housing such that an air-tight cavity filled with a gas is formed between the housing and the membrane. The cavity radially surrounds the internal liquid channel, with the membrane separating the cavity and the internal liquid channel. Volumes of the cavity and channel change in response to deformation of the membrane and based on pressures of the liquid coolant. The membrane may comprise multiple folds extending parallel to the longitudinal axis and distributed circumferentially around the axis.Type: ApplicationFiled: October 23, 2023Publication date: April 24, 2025Inventors: Michael Dustin Scott, Steven J. Dean, Harvey John Lunsman
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Publication number: 20250012296Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.Type: ApplicationFiled: September 17, 2024Publication date: January 9, 2025Inventors: John P. Franz, Steven J. Dean, Ernesto J. Ferrer
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Patent number: 12104618Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.Type: GrantFiled: October 31, 2022Date of Patent: October 1, 2024Assignee: Hewlett Packard Enterprise Development LPInventors: John P. Franz, Steven J. Dean, Ernesto J. Ferrer
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Publication number: 20240306352Abstract: A process includes communicating a coolant flow between an inlet and an outlet of a coolant subsystem that is associated with a cooling domain to remove thermal energy from a plurality of processor-based nodes of the cooling domain. The communication of the coolant flow has associated predefined parameters. The process includes regulating a temperature of the coolant flow at the outlet. In accordance with example implementations, the regulation includes determining, based on the predefined parameters, a minimum collective power consumption by the processor-based nodes to maintain a temperature of the coolant flow at the outlet at or above a minimum threshold temperature, and based on the minimum power consumption, scheduling jobs to be executed by the nodes.Type: ApplicationFiled: March 8, 2023Publication date: September 12, 2024Inventors: Torsten Wilde, Rob J. Rongstad, Peter A. Hansen, Robert E. Mascia, Steven J. Martin, Steven J. Dean, Harvey E. White, JR., Brian T. Purcell
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Publication number: 20240141926Abstract: An example axial pump for delivering liquid coolant to cool an electronic device comprises a conduit defining a flow path from an inlet of the conduit to an outlet of the conduit and an impeller in the conduit. The impeller is rotatable about an axis of rotation parallel to the flow path. The pump also has a motor stator configured to drive rotation of the impeller body about the axis of rotation. In addition, the pump comprises an adjustment mechanism coupling the impeller to the conduit. The adjustment mechanism is actuatable to cause translation of the impeller relative to the conduit. This may allow for adjustment of a clearance between a blade tip of a blade of the impeller and a wall of the conduit.Type: ApplicationFiled: October 31, 2022Publication date: May 2, 2024Inventors: John P. FRANZ, Steven J. DEAN, Ernesto J. FERRER
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Patent number: 10941892Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.Type: GrantFiled: October 20, 2017Date of Patent: March 9, 2021Assignee: Hewlett Packard Enterprise Development LPInventors: Michael Scott, Steven J. Dean, Harvey J. Lunsman
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Patent number: 10521260Abstract: A high performance computing (HPC) system has an architecture that separates data paths used by compute nodes exchanging computational data from the data paths used by compute nodes to obtain computational work units and save completed computations. The system enables an improved method of saving checkpoint data, and an improved method of using an analysis of the saved data to assign particular computational work units to particular compute nodes. The system includes a compute fabric and compute nodes that cooperatively perform a computation by mutual communication using the compute fabric. The system also includes a local data fabric that is coupled to the compute nodes, a memory, and a data node. The data node is configured to retrieve data for the computation from an external bulk data storage, and to store its work units in the memory for access by the compute nodes.Type: GrantFiled: July 14, 2017Date of Patent: December 31, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Steven J. Dean, Michael Woodacre, Randal S. Passint, Eric C. Fromm, Thomas E. McGee, Michael E. Malewicki, Kirill Malkin
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Patent number: 10237999Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space.Type: GrantFiled: October 31, 2016Date of Patent: March 19, 2019Assignee: Hewlett Packard Enterprise Development LPInventors: Harvey Lunsman, Troy Oxby, Michael Peterson, David Collins, Steven J. Dean, Russell Stacy, Andy Warner
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Patent number: 10188016Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.Type: GrantFiled: October 31, 2016Date of Patent: January 22, 2019Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LPInventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
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Publication number: 20180238480Abstract: Male and female fittings are configured to mate to form a valved connector system. Some embodiments of the female fitting include movable poppet configured to sealingly engage a flared projection within the female fitting. Some embodiments of the male fitting include a male mating aperture, and a movable plug configured to sealingly engage the male mating aperture. When the female fitting is mated with a male fitting, the male fitting forces the poppet to disengage from the flared projection, and the flared projection forces the plug to recede into the male fitting, to open a fluid path through the valved connector system.Type: ApplicationFiled: October 20, 2017Publication date: August 23, 2018Inventors: Michael Scott, Steven J. Dean, Harvey J. Lunsman
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Publication number: 20180018196Abstract: A high performance computing (HPC) system has an architecture that separates data paths used by compute nodes exchanging computational data from the data paths used by compute nodes to obtain computational work units and save completed computations. The system enables an improved method of saving checkpoint data, and an improved method of using an analysis of the saved data to assign particular computational work units to particular compute nodes. The system includes a compute fabric and compute nodes that cooperatively perform a computation by mutual communication using the compute fabric. The system also includes a local data fabric that is coupled to the compute nodes, a memory, and a data node. The data node is configured to retrieve data for the computation from an external bulk data storage, and to store its work units in the memory for access by the compute nodes.Type: ApplicationFiled: July 14, 2017Publication date: January 18, 2018Inventors: Steven J. Dean, Michael Woodacre, Randal S. Passint, Eric C. Fromm, Thomas E. McGee, Michael E. Malewicki, Kirill Malkin
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Patent number: 9811127Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.Type: GrantFiled: June 28, 2013Date of Patent: November 7, 2017Assignee: Hewlett Packard Enterprise Development LPInventors: Steven J. Dean, Roger Ramseier, Mark Maloney, David R. Collins
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Publication number: 20170127575Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space. Such apparatus may also include liquid cooling.Type: ApplicationFiled: October 31, 2016Publication date: May 4, 2017Inventors: Harvey Lunsman, Steven J. Dean, Roger Ramseier, Russell Stacy
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Publication number: 20170127549Abstract: The present disclosure is directed to a configurable extension space for a computer server or node blade that has the ability to expand data storage or other functionality to a computer system while minimizing any disruption to computers in a data center when the functionality of a computer server or a node blade is extended. Apparatus consistent with the present disclosure may include multiple electronic assemblies where a first assembly resides deep within an enclosure to which an expansion module may be attached in an accessible expansion space.Type: ApplicationFiled: October 31, 2016Publication date: May 4, 2017Inventors: Harvey Lunsman, Troy Oxby, Michael Peterson, David Collins, Steven J. Dean, Russell Stacy, Andy Warner
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Patent number: 9606588Abstract: A cooling system for a high performance computing system includes a closed-loop cooling cell having two compute racks and a cooling tower between the compute racks. Each compute rack includes at least one blade enclosure, and the cooling tower includes at least one water-cooled heat exchanger and one or more blowers configured to draw warm air from a side of the compute racks towards a back, across the water-cooled heat exchanger, and to circulate cooled air to a side of the compute racks towards a front. The cooling cell further includes a housing enclosing the compute racks and the cooling tower to provide a closed-loop air flow within the cooling cell. The cooling system further includes cooling plate(s) configured to be disposed between two computing boards within the computing blade, and a fluid connection coupled to the cooling plate and in fluid communication with the blade enclosure.Type: GrantFiled: June 28, 2013Date of Patent: March 28, 2017Assignee: Silicon Graphics International Corp.Inventors: Steven J. Dean, David R. Collins, Timothy Scott McCann, Perry D. Franz, Jeffrey M. Glanzman
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Patent number: 9229497Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.Type: GrantFiled: June 28, 2013Date of Patent: January 5, 2016Assignee: Silicon Graphics International Corp.Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
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Patent number: 9128682Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.Type: GrantFiled: July 24, 2013Date of Patent: September 8, 2015Assignee: Silicon Graphics International Corp.Inventors: Steven J. Dean, Robert E. Mascia, Harvey J. Lunsman, Michael Kubisiak, David R. Collins, Timothy S. McCann
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Publication number: 20140126142Abstract: A high performance computing system with a plurality of computing blades has at least one computing blade that includes one or more computing boards and two side rails disposed at either side of the computing board. Each side rail has a board alignment element configured to hold the computing board within the computing blade, so that a top of the computing board is coupled to, and adjacent to, a portion of the board alignment element.Type: ApplicationFiled: June 28, 2013Publication date: May 8, 2014Inventors: Steven J. Dean, Roger Ramseier, Mark Maloney, David R. Collins
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Publication number: 20140126141Abstract: A high performance computing system includes one or more blade enclosures having a cooling manifold and configured to hold a plurality of computing blades, and a plurality of computing blades in each blade enclosure with at least one computing blade including two computing boards. The system further includes two or more cooling plates with each cooling plate between two corresponding computing boards within the computing blade, and a fluid connection coupled to the cooling plate(s) and in fluid communication with the fluid cooling manifold.Type: ApplicationFiled: June 28, 2013Publication date: May 8, 2014Applicant: Silicon Graphics International Corp.Inventors: Steven J. Dean, Richard B. Salmonson, Russell E. Stacy, Roger Ramseier, Mark Maloney
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Publication number: 20140126143Abstract: A high performance computing system includes one or more blade enclosures configured to hold a plurality of computing blades, a connection interface, coupled to the one or more blade enclosures, having one or more connectors and a shared power bus that distributes power to the one or more blade enclosures, and at least one power shelf removably coupled to the one or more connectors and configured to hold one or more power supplies. The system may further include the computing blades and the power supplies. The power shelf may include a power distribution board configured to connect the power supplies together on the shared power bus.Type: ApplicationFiled: July 24, 2013Publication date: May 8, 2014Applicant: Silicon Graphics International Corp.Inventors: Steven J. Dean, Robert E. Mascia, Harvey J. Lunsman, Michael Kubisiak, David R. Collins, Timothy S. McCann