Abstract: An electronic package including a leadframe that includes a single layer of an electrically conducting material, a semiconductor chip support, a common ground portion surrounding the semiconductor chip support and electrically connected thereto, a plurality of signal leads electrically isolated from each other and from the common ground portion, and a plurality of ground leads electrically connected to the common ground portion. A semiconductor chip including a plurality of signal sites and a plurality of ground sites is mounted on the semiconductor chip support of the leadframe. A plurality of electrical connections are provided between selected ones of the signal sites to respective ones of the signal leads and between selected ones of the ground sites to respective ones of the ground leads. A protective enclosure is provided substantially about the semiconductor device, the semiconductor chip support, the common ground portion of the leadframe, and at least a portion of the signal leads.