Patents by Inventor Steven J. Franson

Steven J. Franson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090156128
    Abstract: An eyewear apparatus (100) has a first plurality of antennas (144, 142, 158) disposed thereon for transmitting a signal in a narrow beam (402), for example, with a directivity greater than 10 dBi, the signal comprising at least one of data and video. A microcomputer (126) is coupled to the first plurality of antennas for providing the signal thereto.
    Type: Application
    Filed: December 12, 2007
    Publication date: June 18, 2009
    Applicant: MOTOROLA, INC.
    Inventors: Steven J. Franson, Silviu Chiricescu, Derrick Lim
  • Publication number: 20090149137
    Abstract: A bi-directional transceiver (100) having reduced circuitry and that may be formed on a non-semiconductor substrate includes impedance matching and filtering circuitry (114, 116, 122, 124, 128, 132) coupled to a non-linear diode (118) for converting a lower frequency modulated signal to a higher frequency RF transmit signal and to function as a square-law detector to envelope detect RF signals. The non-linear diode (118) includes, in one exemplary embodiment, at least two insulative layers disposed between two conductive layers, wherein a quantum well is formed between the insulators that allows only high-energy tunneling.
    Type: Application
    Filed: December 6, 2007
    Publication date: June 11, 2009
    Applicant: MOTOROLA, INC.
    Inventors: Stephen K. Rockwell, Steven J. Franson
  • Publication number: 20090080562
    Abstract: A wireless data transfer system. The system includes a first hard disk, a first hard disk interface, and a first transmitter. The first hard disk interface is configured to retrieve first read data from the first hard disk and to create a first bit serial signal from the retrieved first read data. The first bit serial signal conforms to a protocol selected from the group consisting of serial advanced technology attachment (SATA) protocol and serial attached small computer system interface (SAS) protocol. The first transmitter is configured to operate at selected carrier frequency greater than 50 GHz, comprising, to operate at effective isotropic radiated power level less than or equal to 40 dBm, to receive the first bit serial signal from the first hard disk interface, to modulate the first bit serial signal using amplitude shift keying modulation to substantially create directly a first signal, and to transmit the first signal.
    Type: Application
    Filed: September 25, 2007
    Publication date: March 26, 2009
    Applicant: Motorola, Inc.
    Inventor: Steven J. Franson
  • Patent number: 7453412
    Abstract: A communication device (310) is provided that includes a nano-sized RF antenna (100) having low power consumption and wide-range frequency spectrum based on bottom-up nanotechnology. The antenna (100) includes an insulator layer (110) positioned between a free magnetic layer (112) and a fixed magnetic layer (108). A DC voltage source (124) is coupled to the free magnetic layer (112) and the fixed magnetic layer (108) for providing a current (118) therethrough. A detector (126) is coupled between the antenna (100) and the DC voltage source (124) for detecting a change in the current (118) in response to a radiated signal being received by the antenna (100) which causes a change in the spin on electrons in the free magnetic layer (112).
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: November 18, 2008
    Assignee: Motorola, Inc.
    Inventors: Kota V R M Murali, Steven J. Franson
  • Publication number: 20080238779
    Abstract: A communication device (310) is provided that includes a nano-sized RF antenna (100) having low power consumption and wide-range frequency spectrum based on bottom-up nanotechnology. The antenna (100) includes an insulator layer (110) positioned between a free magnetic layer (112) and a fixed magnetic layer (108). A DC voltage source (124) is coupled to the free magnetic layer (112) and the fixed magnetic layer (108) for providing a current (118) therethrough. A detector (126) is coupled between the antenna (100) and the DC voltage source (124) for detecting a change in the current (118) in response to a radiated signal being received by the antenna (100) which causes a change in the spin on electrons in the free magnetic layer (112).
    Type: Application
    Filed: March 26, 2007
    Publication date: October 2, 2008
    Applicant: MOTOROLA, INC.
    Inventors: Kota V. R. M. Murali, Steven J. Franson
  • Publication number: 20080197945
    Abstract: A substrate (12) having two high frequency components (28, 30, 34, 36, 48) positioned on substrates (12) typically used for lower frequency devices. A coplanar strip transmission line (38, 40, 46, 52, 58), providing for transmission of high frequency signals, comprises first, second and third parallel, spaced conductive traces (62, 64, 66) positioned on a surface (11) of the substrate (12), wherein the substrate (12) defines a first slot (68, 72, 76) extending from the first surface (11) into the substrate (12) and between the first and second parallel, spaced conductive traces (64, 62), and a second slot (70, 74, 78) extending from the first surface (11) into the substrate (12) and between the first and third parallel, spaced conductive traces (64, 66). Optionally, an antenna (42, 44, 54, 56) is coupled to the coplanar strip transmission line (46, 58) and comprises first and second antenna traces (41, 43), the substrate (12) defining a third slot (45) therebetween.
    Type: Application
    Filed: February 15, 2007
    Publication date: August 21, 2008
    Applicant: MOTOROLA, INC.
    Inventor: Steven J. Franson
  • Patent number: 7245009
    Abstract: A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: July 17, 2007
    Assignee: Motorola, Inc.
    Inventors: Bruce A. Bosco, Rudy M. Emrick, Steven J. Franson, John E. Holmes, Stephen K. Rockwell
  • Patent number: 7187334
    Abstract: An improved transceiver assembly for a vehicle for detecting potentially hazardous objects is disclosed. The transceiver assembly preferably comprises a patch array feed antenna having an array of a plurality of patches for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that moves to sweeps the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: March 6, 2007
    Assignee: Motorola, Inc.
    Inventors: Steven J. Franson, Rudy M. Emrick
  • Patent number: 7109938
    Abstract: In one embodiment, an improved transceiver assembly for a vehicle capable of detecting potentially hazardous objects is disclosed. The transceiver assembly comprises a tapered slot feed antenna for generating a beam and for detecting the beam as reflected from the potential hazards. The antenna is formed in or on a housing which also contains a parabolic dish that oscillates to sweep the beam of radiation towards the potential hazards outside of the vehicle. In a preferred embodiment, approximately 77 GHz radiation is generated from and detected by the antenna. The antenna is preferably formed on a printed circuit board (PCB) (substrate), which can include additional circuitry necessary to operate the antenna, and which is preferably mounted at an acute angle with respect to the housing to direct the beam at the parabolic dish.
    Type: Grant
    Filed: October 29, 2004
    Date of Patent: September 19, 2006
    Assignee: Motorola, Inc.
    Inventors: Steven J. Franson, Bruce A. Bosco, Rudy M. Emrick, John E. Holmes
  • Patent number: 6952044
    Abstract: According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses “air bridges” or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 4, 2005
    Assignee: Motorola, Inc.
    Inventors: Steven J. Franson, Rudy M. Emrick, Bruce A. Bosco
  • Publication number: 20030222328
    Abstract: According to the most preferred embodiments of the present invention, at least one of the two plates of a capacitor is formed in at least two different layers of an integrated circuit. The methods of the present invention uses “air bridges” or some other dielectric medium to isolate certain portions of the two capacitive plates of a capacitor where at least a portion of one of the capacitive plates passes over at least a portion of the other capacitive plate. The line widths, line separation and number of levels used in the topology of the capacitor will determine the overall capacitance value of a given structure.
    Type: Application
    Filed: May 31, 2002
    Publication date: December 4, 2003
    Inventors: Steven J. Franson, Rudy M. Emrick, Bruce A. Bosco
  • Publication number: 20030015767
    Abstract: Controlling and controlled components are integrated on a monolithic device. High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. The amorphous interface layer dissipates strain and permits the growth of a high quality monocrystalline oxide accommodating buffer layer. The accommodating buffer layer is lattice matched to both the underlying silicon wafer and the overlying monocrystalline material layer. Any lattice mismatch between the accommodating buffer layer and the underlying silicon substrate is taken care of by the amorphous interface layer.
    Type: Application
    Filed: July 17, 2001
    Publication date: January 23, 2003
    Applicant: MOTOROLA, INC.
    Inventors: Rudy M. Emrick, Nestor J. Escalera, Bryan K. Farber, Stephen K. Rockwell, John E. Holmes, Bruce A. Bosco, Steven J. Franson
  • Publication number: 20030010988
    Abstract: High quality epitaxial layers of monocrystalline materials can be grown overlying monocrystalline substrates such as large silicon wafers by forming a compliant substrate for growing the monocrystalline layers. An accommodating buffer layer comprises a layer of monocrystalline oxide spaced apart from a silicon wafer by an amorphous interface layer of silicon oxide. In addition, formation of a compliant substrate may include utilizing surfactant-enhanced epitaxy, epitaxial growth of single crystal silicon onto single crystal oxide, and epitaxial growth of Zintl phase materials. A set of optical components such as optical sources and/or optical detectors is integrated on the overlying monocrystalline materials, and a controller for the optical components is integrated on the substrate or on another monocrystalline semiconductor layer overlying the substrate.
    Type: Application
    Filed: July 11, 2001
    Publication date: January 16, 2003
    Applicant: MOTOROLA, INC.
    Inventor: Steven J. Franson