Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.

Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

Abstract: Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.

Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

Abstract: In one example an electronic device comprises a chassis, a processing device disposed in the chassis, a first heat spreader positioned adjacent the processing device and in thermal communication with the processing device, and a second heat spreader positioned adjacent the first heat spreader and in thermal communication with the first heat spreader. In some examples the second heat spreader is moveable between a first position in which the second heat spreader is disposed within the chassis and a second position in which at least a portion of the second heat spreader extends outside the chassis. Other examples may be described.

Abstract: Systems, methods and apparatuses may provide for a flexible display assembly including a flexible display and a backplane coupled to the flexible display, wherein at least a portion of the backplane comprises a super elastic sheet. In one example, the backplane includes a first rigid sheet metal portion and a second rigid sheet metal portion, wherein the super-elastic sheet is joined between the first and second rigid sheet metal portions.

Abstract: A fan attachment is provided to attach a fan assembly to a cap of a heat exchanger. The fan attachment includes a feature to manage wires going to the fan motor, a notch for a thermister to sense temperature, snap hooks to be engaged by receiving tabs of the cap, a keying shear load feature to radially align the fan attachment and cap, and Z-height tolerance springs to bias the fan attachment away from the cap. The cap has features to interact with those of the fan attachment, including receiving tabs. The fan attachment may be manually aligned and forced so that the snap hooks are received and engaged by the receiving tabs. Additionally, the snap hooks and keying feature are, in combination, capable of supporting fan and attach mechanism in an undamaged condition during 25 g-force shock to the heat exchanger.

Abstract: A heat sink clip that includes a base and a cam rotatably coupled to the base. The base includes a pair of side walls and a pin extending between the side walls such that the cam is rotatably mounted on the pin. When the clip is properly positioned relative to the heat sink and the electronic device, the cam rotates between at least one position where the cam does not compress the heat sink against the electronic device and another position where the cam does compress the heat sink against the electronic device.

Abstract: A heat sink clip that includes a base and a cam rotatably coupled to the base. The base includes a pair of side walls and a pin extending between the side walls such that the cam is rotatably mounted on the pin. When the clip is properly positioned relative to the heat sink and the electronic device, the cam rotates between at least one position where the cam does not compress the heat sink against the electronic device and another position where the cam does compress the heat sink against the electronic device.

Abstract: A heat sink provides efficient heat transfer from a heat-producing semiconductor device. Heat pipes project from a spreader plate in contact with the device and distribute heat to multiple cooling fins. The fins are arranged for maximum contact with the ambient air. An active fan is internally disposed within the fins, for further cooling efficiency. The heat sink may be permanently affixed to a printed circuit board holding the semiconductor device or the heat sink may be attached and released thereto without need of tools. A base plate maintains spring-like compliance of the printed circuit board while allowing sufficient clamping force on the heat sink to sustain thermal contact with the heat-producing surface during shock-loading.