Patents by Inventor Steven J. Messier

Steven J. Messier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CMP apparatus with built-in slurry distribution and removal
    Patent number: 6299515
    Abstract: A polishing apparatus for polishing a substrate. The polishing apparatus has a slurry delivery system for delivering slurry to the apparatus; a porous polishing pad having an upper surface at which the substrate is polished; and a rotating platen upon which the porous pad lies. The rotating platen has a recess which has a first portion in communication with the delivery means for delivering slurry into the first portion. The recess further has a second portion extending under the polishing pad. Slurry is delivered from the first portion to the second portion and to the upper surface of the pad where it aids in the polishing of the substrate. Preferably, the first portion of the recess is situated such that the slurry delivered to the top surface returns to the first portion for removal or reuse due to the rotational force of the rotating platen.
    Type: Grant
    Filed: June 22, 2000
    Date of Patent: October 9, 2001
    Assignee: International Business Machines Corporation
    Inventors: Gary J. Beardsley, Cuc Kim Huynh, Steven J. Messier, David L. Walker
  • CMP apparatus with built-in slurry distribution and removal
    Patent number: 6135865
    Abstract: A polishing apparatus for polishing a substrate. The polishing apparatus has a slurry delivery system for delivering slurry to the apparatus; a porous polishing pad having an upper surface at which the substrate is polished; and a rotating platen upon which the porous pad lies. The rotating platen has a recess which has a first portion in communication with the delivery means for delivering slurry into the first portion. The recess further has a second portion extending under the polishing pad. Slurry is delivered from the first portion to the second portion and to the upper surface of the pad where it aids in the polishing of the substrate. Preferably, the first portion of the recess is situated such that the slurry delivered to the top surface returns to the first portion for removal or reuse due to the rotational force of the rotating platen.
    Type: Grant
    Filed: August 31, 1998
    Date of Patent: October 24, 2000
    Assignee: International Business Machines Corporation
    Inventors: Gary J. Beardsley, Cuc Kim Huynh, Steven J. Messier, David L. Walker