Patents by Inventor Steven J. Osborne
Steven J. Osborne has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11418638Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: GrantFiled: September 12, 2019Date of Patent: August 16, 2022Assignee: Apple Inc.Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Patent number: 10999917Abstract: A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber.Type: GrantFiled: May 10, 2019Date of Patent: May 4, 2021Assignee: Apple Inc.Inventors: Rhett D. Gentile, Peter N. Jeziorek, Sunita Venkatesh, Lauren M. Farrell, Steven J. Osborne
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Patent number: 10664007Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.Type: GrantFiled: September 20, 2018Date of Patent: May 26, 2020Assignee: APPLE INC.Inventors: Steven J. Osborne, Joss N. Giddings, Adam T. Garelli, William F. Leggett, Sarah J. Montplaisir, Eric T. Corriveau, Tyler J. Ewing
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Publication number: 20200100349Abstract: A aesthetically appealing mounting system for an electronic device capable of forming a semi-conductive path for electro-static discharge. The mounting system can include an electrically conductive layer covered by a cosmetic anodized layer with multiple micro-perforations formed through the anodized layer exposing a small portion of the electrically conductive layer. The micro-perforations can be formed by laser-etching the cosmetic anodized layer to provide a grounding path while the micro-perforations remain visually undetectable. A semi-conductive wear layer can be configured to couple with the anodized layer. In some embodiments, the semi-conductive wear layer is in a recess on an electronic device. In some embodiments, the semi-conductive wear layer is comprised of a conformal conductive rubber.Type: ApplicationFiled: May 10, 2019Publication date: March 26, 2020Inventors: Rhett D. Gentile, Peter N. Jeziorek, Sunita Venkatesh, Lauren M. Farrell, Steven J. Osborne
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Publication number: 20200007670Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: ApplicationFiled: September 12, 2019Publication date: January 2, 2020Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Patent number: 10447834Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: GrantFiled: May 26, 2017Date of Patent: October 15, 2019Assignee: Apple Inc.Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Patent number: 10359804Abstract: The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.Type: GrantFiled: December 16, 2014Date of Patent: July 23, 2019Assignee: Apple Inc.Inventors: Bradley J. Hamel, Simon Regis Louis Lancaster-Larocque, Steven J. Osborne, Adam T. Garelli
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Publication number: 20190220065Abstract: This application relates to hidden fasteners within an electronic device. An electronic device can include a top portion and a base portion that includes a housing and a cover attached to the housing by at least one fastener that is not visible through an external surface of the cover. Each fastener includes a receiver housing that retrains spherical components and a pin that can be inserted into an opening in the receiver housing. The pin is retained in the receiver housing by a force imparted against a surface of the pin by the spherical components, which are biased towards an inner surface of the receiver housing sloped towards the opening. The pin can be released when an external magnetic field from a magnet placed proximate the bottom surface of the receiver housing retracts the spherical components away from the opening, thereby reducing the force against the surface of the pin.Type: ApplicationFiled: January 15, 2019Publication date: July 18, 2019Inventors: Simon Regis Louis LANCASTER-LAROCQUE, Kent JOHNSTON, Michael MALONEY, John C. DIFONZO, Gurshan DEOL, Kamal H. HABBOUB, Keith J. HENDREN, Karan BIR, Steven J. OSBORNE, Christiaan A. LIGTENBERG
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Publication number: 20190025874Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.Type: ApplicationFiled: September 20, 2018Publication date: January 24, 2019Inventors: Steven J. Osborne, Joss N. Giddings, Adam T. Garelli, William F. Leggett, Sarah J. Montplaisir, Eric T. Corriveau, Tyler J. Ewing
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Patent number: 10120409Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.Type: GrantFiled: May 20, 2016Date of Patent: November 6, 2018Assignee: APPLE INC.Inventors: Steven J. Osborne, Joss N. Giddings, Adam T. Garelli, William F. Leggett, Sarah J. Montplaisir, Eric T. Corriveau, Tyler J. Ewing
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Publication number: 20180084653Abstract: Embodiments are directed to an enclosure for an electronic device. In one aspect, an embodiment includes an enclosure having an enclosure component and an internal component that may be affixed along a bonding region. The enclosure component may be formed from an enclosure material and defines an exterior surface of the enclosure and an opening configured to receive a display. The internal component may be formed from a metal material different than the enclosure material. The bonding region may include an interstitial material that has a melting temperature that is less than a melting temperature of either one of the enclosure material or the metal material. The bonding region may also include one or more of the enclosure material or the metal material.Type: ApplicationFiled: May 26, 2017Publication date: March 22, 2018Inventors: Abhijeet Misra, Steven J. Osborne, Ian A. Spraggs, Marwan Rammah, William A. Counts
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Publication number: 20160342179Abstract: Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.Type: ApplicationFiled: May 20, 2016Publication date: November 24, 2016Inventors: Steven J. OSBORNE, Joss N. GIDDINGS, Adam T. GARELLI, William F. LEGGETT, Sarah J. MONTPLAISIR, Eric T. CORRIVEAU, Tyler J. EWING
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Publication number: 20150248958Abstract: The described embodiments relate generally to methods to form magnetic assemblies. In particular, extreme cold work (aka cold spray) is used to enhance magnetic properties of a steel alloy (most notably 316L stainless steel and others) that can then be formed into useful shapes and embedded within a substrate without undue machining operations.Type: ApplicationFiled: December 16, 2014Publication date: September 3, 2015Inventors: Bradley J. Hamel, Simon Regis Louis Lancaster-Larocque, Steven J. Osborne, Adam T. Garelli