Abstract: A package handling apparatus for presenting circuit packages to a test head is provided which uses a soft handling approach throughout the system. The handler works with a plurality of sticks, with each stick adapted for holding a plurality of packages in a substantially horizontal linear array, with the linear array defining a linear axis for the stick. The handler includes an input elevator element for receiving a first stick loaded with a first package, for moving the first stick vertically to an index level. An input drive moves the first stick horizontally to an index position. A first pick-up removes the first package from the first stick and then moves the first package to a stage pick-up position. A stage element receives the first package, and presents it to the test head for testing. Once tested, the stage element moves the package to a stage exit position. A stage pick-up then places the first package in a stage row stick.

Abstract: A single dual in-line package integrated circuit component carrier adapted to provide mechanical and static shielding protection is box like with spaced pairs of walls to minimize the size of the carrier but accommodate the 300, 400 or 600 mil DIP component.