Abstract: A nonvolatile memory apparatus includes a separate controller circuit and memory circuit. The controller circuit is fabricated on a first integrated circuit chip. The controller circuit includes a plurality of charge pump circuits, a system interface logic circuit, a memory control logic circuit, and one or more analog circuits. The memory circuit is fabricated on a second integrated circuit chip and includes a column decoder, a row decoder, a control register, and a data register. A memory-controller interface area includes a first plurality of die bond pads on the first integrated circuit chip and a second plurality of die bond pads on the second integrated circuit chip such that the first and second integrated circuit chips may be die-bonded together. A single controller circuit may interface with a plurality of memory circuits, thus further reducing overall costs as each memory circuit does not require a dedicated controller circuit.

Abstract: An apparatus and method identify a plurality of words to be read, read these selected words during a clock latency period, and then shift these words out synchronously at an end of the latency period. In another aspect of the present invention, the above method of reading a plurality of words during a clock latency period and shifting them out synchronously after the latency period is facilitated by a two tier column decoder. The two-tier column decoder has two decoders. A first-tier decoder decodes a first group of words to be read during the latency period, and a second-tier decoder decodes subsequent words to be shifted out synchronously during a burst period.

Abstract: A decoding system for multi-plane memories routes address information corresponding to distinct memory access operations to the designated planes. The system includes an array of functional registers dedicated to random access read, burst read, program, erase, and erase-suspend program operations. Plane selector blocks for each plane receive the address outputs from all of the registers and plane function select logic controls the routing in accord with memory access commands for specified planes. Simultaneous operations of different type in different planes and nested operations in the same plane are possible.

Abstract: A decoding system for multi-plane memories routes address information corresponding to distinct memory access operations to the designated planes. The system includes an array of functional registers dedicated to random access read, burst read, program, erase, and erase-suspend program operations. Plane selector blocks for each plane receive the address outputs from all of the registers and plane function select logic controls the routing in accord with memory access commands for specified planes. Simultaneous operations of different type in different planes and nested operations in the same plane are possible.

Abstract: In a sector in a flash memory array PAGE ERASE and MULTIPLE PAGE ERASE modes of operation are provided. In the PAGE ERASE and MULTIPLE PAGE ERASE modes of operation, a preferred tunneling potential of approximately −10 Volts is applied to the gates of the flash memory cells on the row or rows being selected for erasure, and the bitlines connected to the drains of the flash memory cells are driven to a preferred voltage of approximately 6.5 Volts. To reduce the unintended erasure of memory cells in rows other than the selected row or rows, a preferred bias voltage of approximately 1 to 2 Volts is applied to the gates of all the flash memory cells in the rows other than the selected row or rows.

Abstract: In a sector in a flash memory array PAGE ERASE and MULTIPLE PAGE ERASE modes of operation are provided. In the PAGE ERASE and MULTIPLE PAGE ERASE modes of operation, a preferred tunneling potential of approximately -10 Volts is applied to the gates of the flash memory cells on the row or rows being selected for erasure, and the bitlines connected to the drains of the flash memory cells are driven to a preferred voltage of approximately 6.5 Volts. To reduce the unintended erasure of memory cells in rows other than the selected row or rows, a preferred bias voltage of approximately 1 to 2 Volts is applied to the gates of all the flash memory cells in the rows other than the selected row or rows.

Abstract: A flash memory array architecture comprising a flash memory array, first and second memory buffer, and I/O interface circuit which has several operating modes which permit data to be read from the flash memory array, several operating modes which permit data to be programmed into the flash memory array, and a mode for rewriting the data in the flash memory array.In the four read modes, one of the pages stored in the flash memory array is read, the data stored in either of first or second memory buffers is read, the data in one of the pages of data stored in the flash memory array is read and then written into either of first or second memory buffers, the data in one of the pages of data stored in the flash memory array is read and then compared to the data read from either of first or second memory buffers.

Abstract: A nonvolatile memory device includes two floating-gate-type memory arrays, e.g. a flash memory intended to be used as a relatively permanent program memory and an E.sup.2 PROM intended to be used as a more frequently updated data memory. A single set of address lines and a single set of data lines are used for both read and write operations for both memory arrays. Address decoding means for accessing an addressed location of a selected memory array includes separate column decoders and data latches for each array, but also includes a shared row decoder common to both arrays. Row address latching circuitry associated with at least the data memory holds a decoded row address for that memory array during a write operation so as to free the shared row decoder for use on one or more concurrent read operations for the other memory array, e.g. the program memory. Data I/O buffer circuitry and sense amplifiers are also shared by both arrays.

Abstract: Non-volatile semiconductor core memory performance is enhanced by reduced stress on core memory cells. Stress is reduced by selectable application of bias voltages to the sense line under control of the word line. The word line is connected to an inverting device in turn connected to a transistor effective for grounding the gate of a variable threshold programmable transistor in the memory cell. Power down of the word line is reflected in synchronous power-down of the sense line. Additionally, with power down, the sense amplifier for the particular core memory cell is disconnected from a master latch circuit, which in turn is connected to a slave latch circuit for applying the previous sense amplifier output to an input/output buffer, in order to secure the data sensed in core memory during read operation. The invention further permits reduced word line voltages during erase operation on the sense line and the variable threshold programmable transistor.

Abstract: An EEPROM design featuring narrow linear electrodes including a source, a drain, a thin oxide, channel and floating gate. A pair of linear, opposed field oxide barrier walls form widthwise boundaries of the active structure which can be very closely spaced. The drain electrode, implanted in the substrate, abuts both opposed field oxide lateral walls, but does not extend under either wall. The source, drain and channel are formed in a single implant followed by diffusion after the field oxide barrier walls are formed, but prior to formation of the floating gate. All but opposed field oxide walls in a stripe design. A control gate is disposed over the floating gate. The combination of opposed field oxide barrier walls, a stripe electrode design, and single step implant for electrode formation results in a very compact cell, utilizing a simplified EEPROM process.

Abstract: An EEPROM design featuring narrow linear electrodes including a source, a drain, a thin oxide, channel and floating gate. A pair of linear, opposed field oxide barrier walls form widthwise boundaries of the active structure which can be very closely spaced. The drain electrode, implanted in the substrate, abuts both opposed field oxide lateral walls, but does not extend under either wall. The source, drain and channel are formed in a single implant followed by diffusion after the field oxide barrier walls are formed, but prior to formation of the floating gate. All abut opposed field oxide walls in a stripe design. A control gate is disposed over the floating gate. The combination of opposed field oxide barrier walls, a stripe electrode design, and single step implant for electrode formation results in a very compact cell, utilizing a simplified EEPROM process.

Abstract: A CMOS fabrication process for EEPROMs having high-breakdown-voltage peripheral transistors in which a single implant step early in the process forms buried implants for both the memory cell's tunnel area source and the high voltage transistor's source and drain areas. The single implant step can be formed either before or after the formation of the channel stops and field oxide around the devices. The floating gate of the memory cell and the gates of the other devices are formed with polysilicon, the gates of the high voltage transistor overlapping the buried implants of its source and drain. The sources and drains of the other peripheral devices are then formed, using their polysilicon gates as a self-aligning mask. This may also include the formation of contact source and drain for the high voltage transistor. The process concludes with the formation of one or two layers of conductive lines connecting to specified drains, sources and gates to form a desired circuit pattern.

Abstract: A write-bias gate in the form of an FET is provided for each of the bit-lines. Each FET has its drain electrode connected to logic 1 and its source electrode connected to the bit-line. When one port is writing, the write-bias gates on the other port(s) are driven by a signal which causes them to enter a pass condition, supplying extra current to pull up the bit lines of the non-writing port(s).