Patents by Inventor Steven J. Seipp

Steven J. Seipp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7545497
    Abstract: A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.
    Type: Grant
    Filed: March 10, 2008
    Date of Patent: June 9, 2009
    Assignee: International Business Machines Corporation
    Inventor: Steven J Seipp
  • Publication number: 20080151246
    Abstract: A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.
    Type: Application
    Filed: March 10, 2008
    Publication date: June 26, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: Steven J. Seipp
  • Patent number: 7375809
    Abstract: A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.
    Type: Grant
    Filed: June 20, 2003
    Date of Patent: May 20, 2008
    Assignee: International Business Machines Corporation
    Inventor: Steven J. Seipp
  • Publication number: 20040257570
    Abstract: A method is provided for using a point of interest as a starting point where an alignment is automatically selected by recognition software for a patterned substrate. The method includes disposing the patterned substrate on a stage of an exposure system, the exposure system having an alignment routine including; locating a first point of interest on the patterned substrate; scanning a first area proximate the first point of interest for a first unique feature; defining a periodicity for the patterned substrate; locating a second point of interest based on the periodicity; scanning a second area proximate the second point of interest for a second unique feature corresponding to the first unique feature; gathering alignment data from at least scanning the first and second areas; and determining substrate position relative to the exposure system from alignment data of at least the first and second scanned areas.
    Type: Application
    Filed: June 20, 2003
    Publication date: December 23, 2004
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventor: STEVEN J. SEIPP