Abstract: Systems, methods, and compositions for monitoring and analyzing nucleic acid hybridization state using L-DNA probes are described. The methods include adding L-DNA probes that can be fluorescently detected to a system including D-DNA. The L-DNA probes include primer, target, and antisense nucleotide sequences, and fluorescent dye compounds. The L-DNA probes are particularly useful for monitoring and analyzing various parameters during DNA amplification using the polymerase chain reaction.

Abstract: Systems, methods, and compositions for monitoring and analyzing nucleic acid hybridization state using L-DNA probes are described. The methods include adding L-DNA probes that can be fluorescently detected to a system including D-DNA. The L-DNA probes include primer, target, and antisense nucleotide sequences, and fluorescent dye compounds. The L-DNA probes are particularly useful for monitoring and analyzing various parameters during DNA amplification using the polymerase chain reaction.

Abstract: The invention relates to methods for the determination and detection of nucleic acids sequences in a sample. The nucleic acid may be RNA or DNA or both. The invention also relates to methods for the determination of the presence and species of various microorganisms in a sample. We have also identified a set of oligonucleotide nucleic acid sequences within the rRNAs of Gram-negative organisms that facilitates both the broad identification of Gram-negative organisms as a class when used as a pool, or in combination, for example in a hybridization assay. This set of oligonucleotides may detect sequences that are indicative of the presence of organisms of the broad class of Gram-negative organisms while exhibiting little or no false identification of Gram-positive organisms, and fungi, or other microorganisms. The assay includes concurrent incubation with at least one nucleotide sequence of interest, at least one nucleic acid probe, a fluorosurfactant, and a nuclease.

Abstract: A system predicts die loss for a semiconductor wafer by using a method referred to as universal in-line metric (UILM). A wafer inspection tool detects defects on the wafer and identifies the defects by various defect types. The UILM method applies to various ways of classification of the defect types and takes into account the impact of each defect type on the die loss.

Abstract: A test method provides a sample of wafer level defects most likely to cause yield loss on a semiconductor wafer subdivided into a plurality of integrated circuits (ICs). Defect size and location data from an inspection tool is manipulated in an algorithm based on defect sizes and geometry parameters. The defects are classified by defect size to form size based populations. The contribution of each size range of defect population to yield loss is calculated and random samples for review are selected from each defect size population. The number of samples from each size defect population is proportional to the predicted yield impact of each sample. The method is rapid and permits on-line process modification to reduce yield losses.

Abstract: A test method provides a sample of wafer level defects most likely to cause yield loss on a semiconductor wafer subdivided into a plurality of integrated circuits (ICs). Defect size and location data from an inspection tool is manipulated in an algorithm based on defect sizes and geometry parameters. The defects are classified by defect size to form size based populations. The contribution of each size range of defect population to yield loss is calculated and random samples for review are selected from each defect size population. The number of samples from each size defect population is proportional to the predicted yield impact of each sample. The method is rapid and permits on-line process modification to reduce yield losses.

Abstract: A test method provides a sample of wafer level defects most likely to cause yield loss on a semiconductor wafer subdivided into a plurality of integrated circuits (IC's). Defect size and location data from an inspection tool is manipulated in an algorithm based on defect sizes and geometry parameters. The defects are classified by defect size to form size based populations. The contribution of each size range of defect population to yield loss is calculated and random samples for review are selected from each defect size population. The number of samples from each size defect population is proportional to the predicted yield impact of each sample. The method is rapid and permits on-line process modification to reduce yield losses.

Abstract: A test method provides a sample of wafer level defects most likely to cause yield loss on a semiconductor wafer subdivided into a plurality of integrated circuits (IC's). Defect size and location data from an inspection tool is manipulated in an algorithm based on defect sizes and geometry parameters. The defects are classified by defect size to form size based populations. The contribution of each size range of defect population to yield loss is calculated and random samples for review are selected from each defect size population. The number of samples from each size defect population is proportional to the predicted yield impact of each sample. The method is rapid and permits on-line process modification to reduce yield losses.

Abstract: A test method provides a sample of wafer level defects most likely to cause yield loss on a semiconductor wafer subdivided into a plurality of integrated circuits (IC's). Defect size and location data from an inspection tool is manipulated in an algorithm based on defect sizes and geometry parameters. The defects are classified by defect size to form size based populations The contribution of each size range of defect population to yield loss is calculated and random samples for review are selected from each defect size population. The number of samples from each size defect population is proportional to the predicted yield impact of each sample. The method is rapid and permits on-line process modification to reduce yield losses.

Abstract: A combination scraper and keycase having a hollow body providing a compartment for keys, coins or the like and a pair of blades swingably mounted on the body for movement between positions housed in the body and extended operable positions in which the blade cooperatively forms an elongated scraping edge.