Abstract: Presented is a rail track cleaner vehicle configured for cleaning rail area. The rail track cleaner vehicle includes a wheel assembly, a main frame, a liquid sprayer assembly, an air blower assembly, a vacuum assembly and an electric motor assembly. The rail track cleaner vehicle comprises a plurality of optical camera to capture real time image of the rail area. The rail track cleaner vehicle efficiently and effectively clean the rail area and enables a remote personnel to inspect the cleaning process. The rail track cleaner vehicle substantially reduces manual labor and effort to clean the rail area.

Abstract: Provided is an ostomy wafer cutter for enlarging a hole of an ostomy wafer. The ostomy wafer cutter includes an upper element having a locking means to removably lock a blade element. An upper arm is connected to the upper element. A lower element comprises a platform and a central pin for insertion in the hole of the ostomy wafer. A lower arm is connected to the lower element. A handle portion positioned on at least one of: upper arm and/or lower arm, the handle portion graspable and moveable by a user in a cutting position to bring the upper element in close contact with the lower element causing the cutting edge to cut the ostomy wafer enlarging the hole of the ostomy wafer. The proposed wafer cutter efficiently enlarges the opening of the ostomy wafer and is useful for patients having limited dexterity and/or for elderly people.

Abstract: A housing forms an enclosed chamber. A container essentially fills the chamber is fabricated of a crinkle paper or like material adapted to produce a crackling and rustling sound when touched and manipulated by a user. A plurality of objects within the container are fabricated of a rigid material adapted to provide a three dimensional shape to the container and the housing for facilitating the movement of the crinkle paper or like material when manipulated by the user for creating a sound which will attract game during use.

Abstract: A method of forming a plurality of micro column interconnection structures on a semiconductor includes providing a semiconductor layer. A photoresist layer is formed on the semiconductor layer. A plurality of cavities are etched in the photoresist layer. The plurality of cavities extend through the photoresist layer to the semiconductor layer. Solder is deposited in the plurality of cavities, thereby forming a plurality of micro columns of solder.

Abstract: A method of forming a plurality of micro column interconnection structures on a semiconductor includes providing a semiconductor layer. A photoresist layer is formed on the semiconductor layer. A plurality of cavities are etched in the photoresist layer. The plurality of cavities extend through the photoresist layer to the semiconductor layer. Solder is deposited in the plurality of cavities, thereby forming a plurality of micro columns of solder.

Abstract: A process to form poly sidegate LDD structures on buried channel MOSFETs is described. A polysilicon spacer is formed on the gate after source/drain processing. The spacer is later shorted to the main gate by implantation of neutral impurities. The process is particularly suited for SOI technology.