Patents by Inventor Steven James Corbett

Steven James Corbett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Applying encapsulating material to substrates
    Patent number: 6067709
    Abstract: Providing encapsulated electronic components on a circuit board by providing dams on a circuit board around areas on which respective electronic components will be mounted, mounting the respective electronic components within the dams on the circuit board, and printing encapsulating material through a stencil in order to provide deposits of encapsulating material over the electronic components and within the dams.
    Type: Grant
    Filed: February 23, 1996
    Date of Patent: May 30, 2000
    Assignee: MPM Corporation
    Inventors: Richard Godin, Steven James Corbett, Kenneth Burton Gilleo, Alden Johnson