Abstract: Examples of a leak detection system are disclosed. In one example according to aspects of the present disclosure, a leak detection system includes a housing defining an interior, the housing connected to a component of a water distribution system. The leak detection system also includes a leak detection sensor contained within the interior of the housing and configured to detect a leak within the water distribution system. Additionally, the leak detection system includes a digital signal processing circuit in communication with the leak detection sensor.

Abstract: Examples of a leak detection system are disclosed. In one example according to aspects of the present disclosure, a leak detection system includes a housing defining an interior, the housing connected to a component of a water distribution system. The leak detection system also includes a leak detection sensor contained within the interior of the housing and configured to detect a leak within the water distribution system. Additionally, the leak detection system includes a digital signal processing circuit in communication with the leak detection sensor.

Abstract: A leak detector includes a sensor assembly including at least one sensor configured to sense acoustic signals; and at least one printed circuit board coupled to the sensor assembly and configured to support a processing device, the processing device comprising at least a microcontroller unit (MCU) and a digital signal processor (DSP), wherein the MCU is configured to continually receive acoustic signals from the sensor assembly, and wherein the DSP is configured to remain in a sleep mode except when the MCU wakes the DSP from the sleep mode at predetermined times.

Abstract: Examples of a leak detection system are disclosed. In one example according to aspects of the present disclosure, a leak detection system includes a housing defining an interior, the housing connected to a component of a water distribution system. The leak detection system also includes a leak detection sensor contained within the interior of the housing and configured to detect a leak within the water distribution system. Additionally, the leak detection system includes a digital signal processing circuit in communication with the leak detection sensor.

Abstract: A leak detection system includes a housing for installation within a hydrant; at least one leak detection sensor within the housing; and a transmitter circuit in communication with the at least one leak detection sensor for communicating leak detection data.

Abstract: Examples of a leak detection system are disclosed. In one example according to aspects of the present disclosure, a leak detection system includes a housing defining an interior, the housing connected to a component of a water distribution system. The leak detection system also includes a leak detection sensor contained within the interior of the housing and configured to detect a leak within the water distribution system. Additionally, the leak detection system includes a digital signal processing circuit in communication with the leak detection sensor.

Abstract: A leak detection system includes a housing for installation within a hydrant; at least one leak detection sensor within the housing; and a transmitter circuit in communication with the at least one leak detection sensor for communicating leak detection data.

Abstract: A leak detector includes a sensor assembly including at least one sensor configured to sense acoustic signals; and at least one printed circuit board coupled to the sensor assembly and configured to support a processing device, the processing device comprising at least a microcontroller unit (MCU) and a digital signal processor (DSP), wherein the MCU is configured to continually receive acoustic signals from the sensor assembly, and wherein the DSP is configured to remain in a sleep mode except when the MCU wakes the DSP from the sleep mode at predetermined times.

Abstract: A modular backplane having a low-profile bridge module for industrial computers is disclosed. The modular backplane generally comprises a plurality of modular backplane segments and a plurality of bridge modules for connecting the modular backplane segments. Each modular backplane segment includes a front side and a back side, in which the front side has a plurality of slots and the back side has a primary dedicated connector and a secondary dedicated connector. Each bridge module includes a circuit board, a bridging integrated circuit, and a pair of connectors. One of the bridge connectors is engaged with the primary dedicated connector in one of the backplane segments and the other connector is engaged with the secondary dedicated connector in its neighboring segments, and vice versa, such that all the modular backplane segments are communicatively connected with another. The modular bridge is of a low-profile, and the dedicated connectors are provided in an area where no slot is formed.