Abstract: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

Abstract: An optical inspection sensor is provided. The sensor includes an array of cameras configured to acquire image data relative to a workpiece that moves relative to the array of cameras in a non-stop fashion. An illumination system is disposed to provide a pulse of illumination when the array of cameras acquires the image data. At least some image data includes data regarding a skip mark or barcode on the workpiece.

Abstract: An optical inspection system includes a printed circuit board (PCB) transport and an illuminator that provides at least a first strobed illumination field. The illuminator includes a light pipe having a first end proximate the PCB, and a second end opposite the first end and spaced from the first end. An array of cameras is configured to digitally image the PCB and to generate a plurality of images of the PCB with the at least first strobed illumination field type. At least one structured light projector is disposed to project structured illumination on the PCB. The at least one array of cameras is configured to digitally image the PCB while the PCB is illuminated with structured light, to provide a plurality of structured light images. A processing device is configured to generate an inspection result as a function of the plurality of images and the plurality of structured light images.

Abstract: An optical inspection system (92) for inspecting a workpiece (10) including a feature (60) to be inspected is provided. The system (92) includes a workpiece transport conveyor (26) configured to transport the workpiece (10) in a nonstop manner. The system (92) also includes an illuminator (9) configured to provide a first strobed illumination field type and a second strobed illumination field type. An array of cameras (4) is configured to digitally image the feature, wherein the array of cameras (4) is configured to generate a first image of the feature with the first illumination field and a second image of the feature with the second illumination field. A processing device (90) is operably coupled to the illuminator (9) and the array of cameras (4), the processing device (90) provides an inspection result relative to the feature (60) on the workpiece (10) based, at least in part, upon the first and second images.

Abstract: An electronics assembly line includes a first electronics assembly machine and a second electronics assembly machine. The first electronics assembly machine has a first electronics assembly machine outlet. The second electronics assembly machine has a second electronics assembly machine inlet and outlet. The inlet of the second electronics assembly machine is coupled to the outlet of the first electronics assembly machine by a conveyor. A first optical inspection sensor is disposed over the conveyor before the inlet of the second electronics assembly and is configured to provide first sensor inspection image data relative to a substrate that passes beneath the first optical inspection sensor in a non-stop fashion. A second optical inspection sensor is disposed over the conveyor after the outlet of the second electronics assembly machine and is configured to provide second sensor inspection image data relative to a substrate that passes beneath the second optical inspection sensor in a non-stop fashion.

Abstract: An optical inspection system for inspecting a substrate is provided. The system includes an array of cameras configured to acquire a plurality of sets of images as the substrate and the array undergo relative motion with respect to each other. At least one focus actuator is operably coupled to each camera of the array of cameras to cause displacement of at least a portion of each camera that affects focus. A substrate range calculator is configured to receive at least portions of images from the array and to calculate range between the array of cameras and the substrate. A controller is coupled to the array of cameras and to the range calculator. The controller is configured to provide a control signal to each of the at least one focus actuator to adaptively focus each camera of the array during the relative motion.

Abstract: An optical inspection system and method are provided. A workpiece transport moves a workpiece in a nonstop manner. An illuminator includes a light pipe and is configured to provide a first and second strobed illumination field types. First and second arrays of cameras are arranged to provide stereoscopic imaging of the workpiece. The first array of cameras is configured to generate a first plurality of images of the workpiece with the first illumination field and a second plurality of images of the feature with the second illumination field. The second array of cameras is configured to generate a third plurality of images of the workpiece with the first illumination field and a fourth plurality of images of the feature with the second illumination field. A processing device stores at least some of the first, second, third, and fourth pluralities of images and provides the images to an other device.

Abstract: An illuminator is described which may be used with large inspection areas and which provides a dark field illumination pattern that is spatially uniform, illuminates from consistent angles, has high efficiency, and is smaller than existing solutions. A light pipe has a first end proximate an object to be illuminated and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end of the light pipe includes an exit aperture and the second end has at least one opening to allow at least one image acquisition device to view the surface therethrough. At least one light source is configured to provide illumination in the light pipe. The object is illuminated by the first end of the light pipe by illumination at a selected elevation angle and substantially all azimuth angles.

Abstract: An optical inspection system is provided for inspecting a workpiece including a feature to be inspected. The system includes a workpiece transport configured to transport the workpiece in a nonstop manner. An illuminator is configured to provide a first strobed illumination field type and a second strobed illumination field type. The illuminator includes a light pipe having a first end proximate the feature, and a second end opposite the first end and spaced from the first end. The light pipe also has at least one reflective sidewall. The first end has an exit aperture and the second end has at least one second end aperture to provide a view of the feature therethrough. An array of cameras is configured to digitally image the feature. The array of cameras is configured to generate a first plurality of images of the feature with the first illumination field and a second plurality of images of the feature with the second illumination field.

Abstract: A sensor for sensing component offset and orientation when held on a nozzle of a pick and place machine is provided. The sensor includes a plurality of two-dimensional cameras, a backlight illuminator and a controller. Each camera has a field of view that includes a nozzle of the pick and place machine. The backlight illuminator is configured to direct illumination toward the plurality of two-dimensional cameras. The backlight illuminator is positioned on an opposite side of a nozzle from the plurality of two-dimensional cameras. The controller is coupled to the plurality of two-dimensional cameras and the backlight illuminator. The controller is configured to determine offset and orientation information of the component(s) based upon a plurality of backlit shadow images detected by the plurality of two-dimensional cameras. The controller provides the offset and orientation information to a controller of the pick and place machine.

Abstract: The present invention includes a method of determining a location of a component on a workpiece. A before-placement standard image is acquired of an intended placement location on a standard workpiece. Then, a standard component is placed upon the standard workpiece and the placement is verified. An after-placement standard image is acquired and a standard difference image is created from the before and after standard images. Then, a before-placement test image is acquired of an intended placement location on the workpiece. A component is then placed upon the workpiece, and after-placement test image is acquired. A test difference image is created from the before and after test images. A first offset is calculated between the before standard difference image and the before test image. Then, the test difference is transformed based on the first offset to generate a difference test image (DTR) that is registered to the standard difference image.

Abstract: Embodiments include measuring motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.

Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.

Abstract: A pick and place machine includes a sensor disposed to acquire an image of a nozzle before a pick operation, and one or more images after the pick operation. Image analytics based upon these images reveal important characteristics that can be used to classify the pick operation. In some embodiments, a plurality of after-pick images are acquired at different poses (angular orientations).

Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.

Abstract: An electronics assembly apparatus with improved pick evaluation is provided. The apparatus includes a placement head having at least one nozzle for releasably picking up and holding a component. A robotic system is provided for generating relative movement between the placement head and a workpiece, such as a circuit board. An image acquisition system is disposed to obtain at least one before-pick image of a component pick up location and at least one after-pick image of the component pick up location. The before-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view, while the after-pick image contains a plurality of image portions, having each image portion view the pick-up location from a different point of view.

Abstract: Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include inspecting the pick operation in pick and place machines by collecting images of the pick event inside the machine and identifying errors as they happen. By detecting and displaying this information as it generated on the machine, the operator or machine can take prompt and effective corrective actions.

Abstract: An inspection system for inspecting web printed electronic circuitry includes a strobed illuminator, a detector, a motion encoder, and a processor. The strobed illuminator is adapted to project light through a reticle to project a pattern of light onto an area of the web. The projected light occurs in a pulse sufficiently short to essentially freeze the web motion. The system projects the pattern of light onto the area of the web in at least two different positions of the web each position corresponding to a different phase of the projected light. A detector is adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. The motion encoder provides a position output relative to a position of the web. The processor is coupled to the encoder, the illuminator and the detector. The processor is adapted to synchronize the illuminator with the web motion to expose the area of the web.

Abstract: An optical device is provided which includes a plurality of optical modules and an alignment compensation module. Each optical module includes an optical component fixedly coupled to a relative reference mount. The relative reference mount is configured to attach to a substrate. A plurality of optical modules mount on the substrate to form the optical device. The alignment compensation module removes residual alignment errors of the optical device.

Abstract: A method and apparatus for facilitating validation of component feeder exchanges in pick and place machines are provided. A pre-exchange image of a component from a feeder is acquired and compared with an image a component from the exchanged feeder placed after the feeder exchange. A comparison of the pre-exchange image with the post-exchange image facilitates simple and quick feeder exchange validation. Aspects of the present invention are practicable with different types of pick and place machines, and are able to advantageously use sensors and/or technician supplied information to generate automatic indications of feeder exchange validity.