Abstract: A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.

Abstract: A single-photon detector includes a superconductor strip biased near its critical current. The superconductor strip provides a discernible output signal upon absorption of a single incident photon. In one example, the superconductor is a strip of NbN (niobium nitride). In another example, the superconductor strip meanders to increase its probability of receiving a photon from a light source. The single-photon detector is suitable for a variety of applications including free-space and satellite communications, quantum communications, quantum cryptography, weak luminescence, and semiconductor device testing.

Abstract: Systems and methods consistent with principles of the present invention allow contactless measuring of various kinds of electrical activity within an integrated circuit. The invention can be used for high-bandwidth, at speed testing of various devices on a wafer during the various stages of device processing, or on packaged parts at the end of the manufacturing cycle. Power is applied to the test circuit using conventional mechanical probes or other means, such as CW laser light applied to a photoreceiver provided on the test circuit. The electrical test signal is introduced into the test circuit by stimulating the circuit using a contactless method, such as by directing the output of one or more modelocked lasers onto high-speed receivers on the circuit, or by using a high-speed pulsed diode laser.

Abstract: A method and system of testing integrated circuits (IC) via optical coupling. The optical system includes an optical fiber, fixture and focusing element. In addition, channels are provided in the fixture mounted on the integrated circuit to accommodate the optical system. The fixture acts as a heat sink. As such, one or more photosensitive elements/targets on the integrated circuit are probed using light that is brought to a focus on each target site. The light causes latching of data into the integrated circuit (which is operating under influence of a test program) and formation of a test pattern output from the integrated circuit that is used to confirm proper functioning of the IC.

Abstract: A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.

Abstract: A beacon circuit enabling study of active elements in an integrated circuit is disclosed. The beacon circuit may be integral to a DUT to be tested. The DUT is stimulated by a conventional ATE, so that its active devices are operating. The signal from the active device is sent to the beacon circuit which, in response to the signal, emits light having intensity that is proportional to the value of the signal. In one example, the beacon circuit is constructed as a voltage to current converter having its input connected to the node of interest and its output connected to a current to light converter. In one example, the current to light converter is implemented as a current mirror circuit. One beneficial implementation disclosed is the use of the beacon circuit for the study of voltage supply disturbances.

Abstract: Systems and methods consistent with principles of the present invention allow contactless measurements of voltage characteristics of dynamic electrical signals in integrated circuits. The invention utilizes a signal analysis circuit, such as a voltage comparator, disposed with the circuit under test, which is optically coupled with the external timing measurement equipment. The signal analysis circuit changes its state depending on the characteristics of the measured electrical signal applied thereto. The changes in the condition of the signal analysis circuit are sensed by the external timing measurement equipment provided outside the circuit under test. To this end, the signal analysis circuit is optically coupled with the external measurement equipment registering specific changes in the condition of the signal analysis circuit.

Abstract: A method and system of testing integrated circuits (IC) via optical coupling. The optical system includes an optical fiber, fixture and focussing element. In addition, channels are provided in the fixture mounted on the integrated circuit to accommodate the optical system. The fixture acts as a heat sink. As such, one or more photosensitive elements/targets on the integrated circuit are probed using light that is brought to a focus on each target site. The light causes latching of data into the integrated circuit (which is operating under influence of a test program) and formation of a test pattern output from the integrated circuit that is used to confirm proper functioning of the IC.

Abstract: Systems and methods consistent with principles of the present invention allow contactless measurements of voltage characteristics of dynamic electrical signals in integrated circuits. The invention utilizes a signal analysis circuit, such as a voltage comparator, disposed with the circuit under test, which is optically coupled with the external timing measurement equipment. The signal analysis circuit changes its state depending on the characteristics of the measured electrical signal applied thereto. The changes in the condition of the signal analysis circuit are sensed by the external timing measurement equipment provided outside the circuit under test. To this end, the signal analysis circuit is optically coupled with the external measurement equipment registering specific changes in the condition of the signal analysis circuit.

Abstract: A universal diagnostic platform (UDP) is described which incorporates several measurement modules for testing a device under test (DUT). Users can switch between measurement modules without removing the DUT. The UDP employs a common fixturing and software system for all the modules.

Abstract: A system and method for calibration of a commercial semiconductor test system (tester). The system receives a synchronization signal from the tester and detects light emission from a device under test (DUT). The system then compares the timing and characteristics of the light emission to the synchronization signal to obtain a delay timing and signal change caused by intermediate elements of the tester. The delay timing and signal change are used to calibrate the various channels of the tester. Also described are various designs for DUT's to obtained enhanced accuracy of the delay timing. Further, a system and method are described for reconstruction of a test signal and study of the effects of intermediate elements of the tester on the shape of the test signal.

Abstract: A beacon circuit enabling study of active elements in an integrated circuit is disclosed. The beacon circuit may be integral to a DUT to be tested. The DUT is stimulated by a conventional ATE, so that its active devices are operating. The signal from the active device is sent to the beacon circuit which, in response to the signal, emits light having intensity that is proportional to the value of the signal. In one example, the beacon circuit is constructed as a voltage to current converter having its input connected to the node of interest and its output connected to a current to light converter. In one example, the current to light converter is implemented as a current mirror circuit. One beneficial implementation disclosed is the use of the beacon circuit for the study of voltage supply disturbances.

Abstract: A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.

Abstract: A method and system of testing integrated circuits (IC) via optical coupling. The optical system includes an optical fiber, fixture and focussing element. In addition, channels are provided in the fixture mounted on the integrated circuit to accommodate the optical system. The fixture acts as a heat sink. As such, one or more photosensitive elements/targets on the integrated circuit are probed using light that is brought to a focus on each target site. The light causes latching of data into the integrated circuit (which is operating under influence of a test program) and formation of a test pattern output from the integrated circuit that is used to confirm proper functioning of the IC.

Abstract: A system and method for automatically and accurately determining the exact location of a knife-edge, such as an edge of an optical shutter, so that it can be controlled automatically. In one aspect the system comprises a mechanized shutter coupled to a shutter controller that can automatically control the shutter's location and movement. According to one implementation of the shutter controller the system takes a first image at a first shutter position. The shutter is then moved a predetermined about and a second image is taken. Then, the pixels of each image are added in the direction perpendicular to the movement of the shutter, so as to provide two one-dimension functions. A linear difference of the functions is then taken, so as to obtain a one-dimensional linear difference function. A peak in the linear difference function is then identified as the location of the shutter.

Abstract: A system, apparatus, and method for analyzing photon emission data to discriminate between photons emitted by transistors and photons emitted by background sources. The analysis involves spatial and/or temporal correlation of photon emissions. After correlation, the analysis may further involve obtaining a likelihood that the correlated photons were emitted by a transistor. After correlation, the analysis may also further involve assigning a weight to individual photon emissions as a function of the correlation. The weight, in some instances, reflecting a likelihood that the photons were emitted by a transistor. The analysis may further involve automatically identifying transistors in a photon emission image.

Abstract: A single-photon detector includes a superconductor strip biased near its critical current. The superconductor strip provides a discernible output signal upon absorption of a single incident photon. In one example, the superconductor is a strip of NbN (niobium nitride). In another example, the superconductor strip meanders to increase its probability of receiving a photon from a light source. The single-photon detector is suitable for a variety of applications including free-space and satellite communications, quantum communications, quantum cryptography, weak luminescence, and semiconductor device testing.

Abstract: Systems and methods consistent with principles of the present invention allow contactless measuring of various kinds of electrical activity within an integrated circuit. The invention can be used for high-bandwidth, at speed testing of various devices on a wafer during the various stages of device processing, or on packaged parts at the end of the manufacturing cycle. Power is applied to the test circuit using conventional mechanical probes or other means, such as CW laser light applied to a photoreceiver provided on the test circuit. The electrical test signal is introduced into the test circuit by stimulating the circuit using a contactless method, such as by directing the output of one or more modelocked lasers onto high-speed receivers on the circuit, or by using a high-speed pulsed diode laser.

Abstract: A system for temporal and spectral resolved detection of photon emission from an integrated circuit is disclosed. A DUT is stimulated by a conventional ATE, so that its active devices emit light. The signal from the ATE is also sent to the system's computer as a synchronization signal. The light emitted from the switching devices is passed through a wavelength filter. Selected bands of wavelengths are then passed to respective detector(s) and the detector(s) response with respect to the time correlated ATE stimulus is studied.

Abstract: A combination cooling plate and micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes a transparent heat spreader and micro-spray heads disposed about the heat spreader. The spray heads spray cooling liquid onto a periphery of said heat spreader so as to remove heat from the chip. Alternatively, and micro-spray heads are provided inside the cooling plate holder so as to spray cooling liquid inside the interior of the holder so that the holder is cooled. The holder is in physical contact with the heat spreader, so that as the holder is cooled by the spray, heat is removed from the heat spreader, and thereby from the chip.