Patents by Inventor Steven Klein
Steven Klein has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250112392Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.Type: ApplicationFiled: December 13, 2024Publication date: April 3, 2025Applicant: Intel CorporationInventors: Richard Canham, Ernesto Borboa Lizarraga, Daniel Neumann, Shelby Ferguson, Eric Buddrius, Hardikkumar Prajapati, Kirk Wheeler, Steven Klein, Shaun Immeker, Jeffory L. Smalley
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Publication number: 20250082749Abstract: A Dectin-2 ligand vaccine adjuvant and a method of making and using the Dectin-2 ligand vaccine adjuvant in a vaccine to immunize a patient are disclosed. Also discloses is a vaccine composition comprising a Bl-Eng2 antigen and methods of using the vaccine composition to immunize a subject against a fungal infection.Type: ApplicationFiled: August 19, 2024Publication date: March 13, 2025Inventors: Bruce Steven Klein, Huafeng Wang, Marcel Wuethrich, Tristan Theodore Brandhorst
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Publication number: 20250055217Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.Type: ApplicationFiled: October 28, 2024Publication date: February 13, 2025Applicant: Intel CorporationInventors: Min Pei, Lejie Liu, Ralph Miele, Phil Geng, Steven Klein
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Patent number: 12097258Abstract: A Dectin-2 ligand vaccine adjuvant and a method of making and using the Dectin-2 ligand vaccine adjuvant in a vaccine to immunize a patient are disclosed. Also discloses is a vaccine composition comprising a Bl-Eng2 antigen and methods of using the vaccine composition to immunize a subject against a fungal infection.Type: GrantFiled: February 26, 2021Date of Patent: September 24, 2024Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: Bruce Steven Klein, Huafeng Wang, Marcel Wuethrich, Tristan Theodore Brandhorst
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Publication number: 20240222288Abstract: Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.Type: ApplicationFiled: December 28, 2022Publication date: July 4, 2024Applicant: Intel CorporationInventors: David Shia, Timothy Gosselin, Aravindha Antoniswamy, Sergio Antonio Chan Arguedas, Elah Bozorg-Grayeli, Johnny Cook, JR., Steven Klein, Rick Canham
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Patent number: 12009612Abstract: Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.Type: GrantFiled: September 25, 2020Date of Patent: June 11, 2024Assignee: Intel CorporationInventors: Srikant Nekkanty, Steven Klein, Feroz Mohammad, Joe Walczyk, Kuang Liu, Zhichao Zhang
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Patent number: 11916322Abstract: Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.Type: GrantFiled: September 25, 2020Date of Patent: February 27, 2024Assignee: Intel CorporationInventors: Srikant Nekkanty, Steven Klein, Feroz Mohammad
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Patent number: 11789019Abstract: The present application discloses proteins or peptides and methods of using such proteins or peptides to evaluate the immune status of a patient. In one embodiment, proteins or peptides may be used to detect endogenous calnexin specific CD4 T cells. In one preferred embodiment, the proteins or peptides may comprise peptide-MHCII tetramers (pMHC tetramers).Type: GrantFiled: August 1, 2019Date of Patent: October 17, 2023Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: Bruce Steven Klein, Marcel Wuethrich
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Patent number: 11414122Abstract: According to one or more embodiments, a steer by wire steering system includes a handwheel actuator, a roadwheel actuator, and a resynchronization module to dynamically adjust handwheel position that is used for rack position reference calculation. The dynamic adjustment includes determining a desynchronization amount based on a difference in an actual handwheel position and a synchronized handwheel position. The dynamic adjustment further includes computing a handwheel adjustment using the desynchronization amount, a vehicle speed, and a handwheel speed. The dynamic adjustment further includes computing an adjusted handwheel position based on the handwheel adjustment and the actual handwheel position. The dynamic adjustment further includes updating the reference rack position based on the adjusted handwheel position. The dynamic adjustment is continuously repeated until the handwheel adjustment is substantially equal to zero.Type: GrantFiled: March 1, 2019Date of Patent: August 16, 2022Assignee: Steering Solutions IP Holding CorporationInventors: Kai Zheng, Steven Klein, Mariam Swetha George, Scott T. Sanford
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Publication number: 20220102883Abstract: Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.Type: ApplicationFiled: September 25, 2020Publication date: March 31, 2022Applicant: Intel CorporationInventors: Srikant Nekkanty, Steven Klein, Feroz Mohammad
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Publication number: 20220102892Abstract: Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.Type: ApplicationFiled: September 25, 2020Publication date: March 31, 2022Applicant: Intel CorporationInventors: Srikant Nekkanty, Steven Klein, Feroz Mohammad, Joe Walczyk, Kuang Liu, Zhichao Zhang
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Publication number: 20220069532Abstract: An integrated circuit assembly may be formed comprising an electronic socket having at least one conductive pin, wherein a portion of the conductive pin extends from the electronic socket. The integrated circuit assembly further comprises a conductive interposer including at least one conductive via having a conductive layer on a sidewall thereof. The conductive interposer is abutted against the electronic socket, such that the at least one conductive pin is inserted into the at least one conductive via and is biased against the conductive layer of the at least one conductive via. In further embodiments, an integrated circuit package may be electrically attached to the conductive interposer.Type: ApplicationFiled: September 1, 2020Publication date: March 3, 2022Applicant: Intel CorporationInventors: Feroz Mohammad, Steven Klein, Srikant Nekkanty
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Patent number: 11094304Abstract: A mute holder for a music stand includes a mute supporting plate having a plurality of mute supporting through holes for holding mutes, a non-continuous flat bottom edge, and a curved front edge forwardly extended from the flat bottom edge; a locking mechanism having a half-circular locking ring having one end attached on the flat bottom edge of the mute supporting plate and an opposite free end pivotably rotated with respect to the flat bottom edge of the mute supporting plate to lock the free end thereon and to release from the passes supporting plate; wherein the locking mechanism further includes a locking screw passing through the half-circular locking ring and to be biased against the music stand for locking thereon.Type: GrantFiled: December 30, 2019Date of Patent: August 17, 2021Inventor: Steven Klein
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Publication number: 20210205445Abstract: A Dectin-2 ligand vaccine adjuvant and a method of making and using the Dectin-2 ligand vaccine adjuvant in a vaccine to immunize a patient are disclosed. Also discloses is a vaccine composition comprising a Bl-Eng2 antigen and methods of using the vaccine composition to immunize a subject against a fungal infection.Type: ApplicationFiled: February 26, 2021Publication date: July 8, 2021Applicant: Wisconsin Alumni Research FoundationInventors: Bruce Steven Klein, Huafeng Wang, Marcel Wuethrich, Tristan Theodore Brandhorst
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Publication number: 20210201862Abstract: A mute holder for a music stand includes a mute supporting plate having a plurality of mute supporting through holes for holding mutes, a non-continuous flat bottom edge, and a curved front edge forwardly extended from the flat bottom edge; a locking mechanism having a half-circular locking ring having one end attached on the flat bottom edge of the mute supporting plate and an opposite free end pivotably rotated with respect to the flat bottom edge of the mute supporting plate to lock the free end thereon and to release from the passes supporting plate; wherein the locking mechanism further includes a locking screw passing through the half-circular locking ring and to be biased against the music stand for locking thereon.Type: ApplicationFiled: December 30, 2019Publication date: July 1, 2021Inventor: Steven Klein
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Patent number: 11012916Abstract: A mobile device includes a processor and memory storing instructions that cause the processor to effectuate operations. The operations include determining that the mobile device does not meet a camping threshold for a cell of a network, determining that the mobile device is synchronized with the cell, and permitting a limited network communication between the mobile device and the network via the cell. The limited network communication may be limited to text-only communications, emergency communications, or the like.Type: GrantFiled: December 11, 2017Date of Patent: May 18, 2021Assignee: AT&T Mobility II LLCInventor: Robert Steven Klein
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Patent number: 10806776Abstract: A vaccine comprising Calnexin fragment and a method of using the vaccine to immunize a patient against fungi are disclosed. The Calnexin fragment may be either a full-length native version or a functionally equivalent version of full-length Calnexin.Type: GrantFiled: May 2, 2018Date of Patent: October 20, 2020Assignee: WISCONSIN ALUMNI RESEARCH FOUNDATIONInventors: Bruce Steven Klein, Theodore Tristan Brandhorst, Thomas Sullivan, Marcel Wuethrich
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Publication number: 20200277004Abstract: According to one or more embodiments, a steer by wire steering system includes a handwheel actuator, a roadwheel actuator, and a resynchronization module to dynamically adjust handwheel position that is used for rack position reference calculation. The dynamic adjustment includes determining a desynchronization amount based on a difference in an actual handwheel position and a synchronized handwheel position. The dynamic adjustment further includes computing a handwheel adjustment using the desynchronization amount, a vehicle speed, and a handwheel speed. The dynamic adjustment further includes computing an adjusted handwheel position based on the handwheel adjustment and the actual handwheel position. The dynamic adjustment further includes updating the reference rack position based on the adjusted handwheel position. The dynamic adjustment is continuously repeated until the handwheel adjustment is substantially equal to zero.Type: ApplicationFiled: March 1, 2019Publication date: September 3, 2020Inventors: Kai Zheng, Steven Klein, Mariam Swetha George, Scott T. Sanford
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Publication number: 20190361022Abstract: The present application discloses proteins or peptides and methods of using such proteins or peptides to evaluate the immune status of a patient. In one embodiment, proteins or peptides may be used to detect endogenous calnexin specific CD4 T cells. In one preferred embodiment, the proteins or peptides may comprise peptide-MHCII tetramers (pMHC tetramers).Type: ApplicationFiled: August 1, 2019Publication date: November 28, 2019Inventors: Bruce Steven Klein, Marcel Wuethrich
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Patent number: 10416158Abstract: The present application discloses proteins or peptides and methods of using such proteins or peptides to evaluate the immune status of a patient. In one embodiment, proteins or peptides may be used to detect endogenous calnexin specific CD4 T cells. In one preferred embodiment, the proteins or peptides may comprise peptide-MHCII tetramers (pMHC tetramers).Type: GrantFiled: March 10, 2015Date of Patent: September 17, 2019Assignee: Wisconsin Alumni Research FoundationInventors: Bruce Steven Klein, Marcel Wuethrich