Abstract: A method is disclosed. The method includes providing a lighting assembly including at least one lighting element, attaching at least one attachment assembly to the lighting assembly, forming an empty space between the lighting assembly and a sound absorbing assembly based on attaching the sound absorbing assembly to the at least one attachment assembly, the sound absorbing assembly including at least one sound absorbing member, and illuminating a translucent or transparent layer using the at least one lighting element.

Abstract: A method is disclosed. The method includes providing a lighting assembly including at least one lighting element, attaching at least one attachment assembly to the lighting assembly, forming an empty space between the lighting assembly and a sound absorbing assembly based on attaching the sound absorbing assembly to the at least one attachment assembly, the sound absorbing assembly including at least one sound absorbing member, and illuminating a translucent or transparent layer using the at least one lighting element.

Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

Abstract: A Land Grid Array (LGA) interface assembly used to physically interface or connect a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) and a PCB, motherboard, etc. The LGA interface assembly including an LGA socket including a plurality of socket pins arranged and configured to contact a plurality of contact pads on the semiconductor package to enable data transfer. The socket pins including a multi-bend and/or zig-zag configuration arranged and configured to minimize lateral displacement of the socket pin relative to the contact pad during insertion of the semiconductor package into the LGA socket. Other embodiments are described and claimed.

Abstract: Integrated circuit (IC) device substrates and structures for mating and aligning with sockets. An IC device may include a frame on and around a substrate, which may include glass or silicon. The frame may include an alignment feature, such as a notch or hole, to mate with a complementary keying feature of a socket. A heat spreader may be coupled to an IC die and extend beyond the substrate or be coupled to the frame. The heat spreader may include a heat pipe. The IC device may be part of an IC system with the device substrate coupled to a system substrate by a socket configured to mate to the frame.

Abstract: Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.

Abstract: Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.

Abstract: According to one or more embodiments, a steer by wire steering system includes a handwheel actuator, a roadwheel actuator, and a resynchronization module to dynamically adjust handwheel position that is used for rack position reference calculation. The dynamic adjustment includes determining a desynchronization amount based on a difference in an actual handwheel position and a synchronized handwheel position. The dynamic adjustment further includes computing a handwheel adjustment using the desynchronization amount, a vehicle speed, and a handwheel speed. The dynamic adjustment further includes computing an adjusted handwheel position based on the handwheel adjustment and the actual handwheel position. The dynamic adjustment further includes updating the reference rack position based on the adjusted handwheel position. The dynamic adjustment is continuously repeated until the handwheel adjustment is substantially equal to zero.

Abstract: Techniques and mechanisms for coupling packaged devices with a socket device. In an embodiment, the socket device comprises a socket body structure and conductors extending therethrough. A pitch of the conductors is in a range of between 0.1 millimeters (mm) and 3 mm. First and second metallization structures also extend, respectively, from opposite respective sides of the socket body structure. In the socket body structure, a conductive shield structure, electrically coupled to the first and second metallization structures, substantially extends around one of the conductors. For each of the first and second metallization structures, a vertical span of the metallization structure is in a range of between 0.05 mm and 2.0 mm, a portion of a side of the metallization structure forms a respective corrugation structure, and a horizontal span of the portion is at least 5% of the vertical span of the metallization structure.

Abstract: Techniques and mechanisms for coupling packaged devices with a dual-sided socket device. In an embodiment, two interfaces of the socket device comprise, respectively, first metallization structures and second metallization structures on opposite sides of a socket body structure. The first metallization structures each form a respective corrugation structure to electrically couple with a corresponding conductive contact of a first packaged device. The corrugation structures facilitate such electrical coupling each via a vertical wipe of the corresponding conductive contact. In another embodiment, a pitch of the first metallization structures is in a range of between 0.1 millimeters (mm) and 2 mm. One such metallization structure has a vertical span in a range of between 0.05 mm and 2.0 mm, where a portion of a side of the metallization structure forms a corrugation structure, and has a horizontal span which is at least 5% of the vertical span.

Abstract: An integrated circuit assembly may be formed comprising an electronic socket having at least one conductive pin, wherein a portion of the conductive pin extends from the electronic socket. The integrated circuit assembly further comprises a conductive interposer including at least one conductive via having a conductive layer on a sidewall thereof. The conductive interposer is abutted against the electronic socket, such that the at least one conductive pin is inserted into the at least one conductive via and is biased against the conductive layer of the at least one conductive via. In further embodiments, an integrated circuit package may be electrically attached to the conductive interposer.

Abstract: A mute holder for a music stand includes a mute supporting plate having a plurality of mute supporting through holes for holding mutes, a non-continuous flat bottom edge, and a curved front edge forwardly extended from the flat bottom edge; a locking mechanism having a half-circular locking ring having one end attached on the flat bottom edge of the mute supporting plate and an opposite free end pivotably rotated with respect to the flat bottom edge of the mute supporting plate to lock the free end thereon and to release from the passes supporting plate; wherein the locking mechanism further includes a locking screw passing through the half-circular locking ring and to be biased against the music stand for locking thereon.

Abstract: A mute holder for a music stand includes a mute supporting plate having a plurality of mute supporting through holes for holding mutes, a non-continuous flat bottom edge, and a curved front edge forwardly extended from the flat bottom edge; a locking mechanism having a half-circular locking ring having one end attached on the flat bottom edge of the mute supporting plate and an opposite free end pivotably rotated with respect to the flat bottom edge of the mute supporting plate to lock the free end thereon and to release from the passes supporting plate; wherein the locking mechanism further includes a locking screw passing through the half-circular locking ring and to be biased against the music stand for locking thereon.

Abstract: According to one or more embodiments, a steer by wire steering system includes a handwheel actuator, a roadwheel actuator, and a resynchronization module to dynamically adjust handwheel position that is used for rack position reference calculation. The dynamic adjustment includes determining a desynchronization amount based on a difference in an actual handwheel position and a synchronized handwheel position. The dynamic adjustment further includes computing a handwheel adjustment using the desynchronization amount, a vehicle speed, and a handwheel speed. The dynamic adjustment further includes computing an adjusted handwheel position based on the handwheel adjustment and the actual handwheel position. The dynamic adjustment further includes updating the reference rack position based on the adjusted handwheel position. The dynamic adjustment is continuously repeated until the handwheel adjustment is substantially equal to zero.

Abstract: A mounting system to couple containers together includes a pair of container bodies coupled together, each container body having a bottom end connected to a top open end with a cap disposed thereon, a pair of recesses disposed in the bottom ends of the first and second container bodies, the recess of the first container body being sufficiently large to receive the cap of the second container body, the recess formed by an inner face coupled to a side wall, the side wall of the recess having a plurality of friction beam assemblies coupled thereto, each friction beam assembly in the plurality of friction beam assemblies separated from an adjacent friction beam assembly by space along the side wall of the recess. Insertion of the cap of the second container body into the recess of the first container body creates a frictional grip and a vacuum seal.

Abstract: A mounting system to couple containers together includes a pair of container bodies coupled together, each container body having a bottom end connected to a top open end with a cap disposed thereon, a pair of recesses disposed in the bottom ends of the first and second container bodies, the recess of the first container body being sufficiently large to receive the cap of the second container body, the recess formed by an inner face coupled to a side wall, the side wall of the recess having a plurality of friction beam assemblies coupled thereto, each friction beam assembly in the plurality of friction beam assemblies separated from an adjacent friction beam assembly by space along the side wall of the recess. Insertion of the cap of the second container body into the recess of the first container body creates a frictional grip and a vacuum seal.

Abstract: A container has an open top end and a closed bottom end. A chamber is provided between the top and bottom ends. The top end is formed as a neck. The bottom end is formed as a recess. The neck and recess are essentially cylindrical. The neck and recess have a common axis and an essentially common length and diameter. The recess is adapted to receive a neck of another similarly configured bottle/container system. The neck is adapted to be coupled to a recess of another similarly configured bottle/container system.

Abstract: Provided are a method, system and program for selecting a path comprising ports on primary and secondary clusters to use to transmit data at a primary volume to a secondary volume. A request is received to copy data from a primary storage location to a secondary storage location. A determination is made from a plurality of primary clusters of an owner primary cluster for the primary storage location, wherein the primary clusters are configured to access the primary storage location. A determination is made as to whether there is at least one port on the owner primary cluster providing an available path to the secondary storage location. One port on the owner primary cluster is selected to use to copy the data to the secondary storage location in response to determining that there is at least one port on the owner primary cluster available to transmit to the secondary storage location.

Abstract: Provided are a method, system and program for considering remote end point performance to select a remote end point to use to transmit a task. A maximum outstanding tasks and a current outstanding tasks comprising a number of outstanding tasks transmitted over a network are provided. A task is received to transmit over the network. A determination is made as to whether the current outstanding tasks is less than the maximum outstanding tasks. The received task is transmitted over the network in response to determining that the current outstanding tasks is less than the maximum outstanding tasks.