Patents by Inventor Steven L. Alexander

Steven L. Alexander has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for through hole substrate printing
    Patent number: 5322565
    Abstract: A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
    Type: Grant
    Filed: December 19, 1991
    Date of Patent: June 21, 1994
    Assignee: Delco Electronics Corporation
    Inventors: Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Bruce A. Myers, Charles T. Eytcheson
  • Method and apparatus for through hole substrate printing
    Patent number: 5080929
    Abstract: A method and apparatus are disclosed for enabling automated printing of through holes extending between top and bottom surfaces of a ceramic substrate or the like. The perimeter of the substrate is placed on a support that locates the bottom surface of the substrate spaced from a member that interacts with the interior portion of the substrate. The interacting member has holes that correspond to the through holes in the substrate, and it is moved generally perpendicular to the substrate to a position where it is in juxtaposition with the bottom surface of the substrate and its holes are in registration with the holes in the substrate. Conductive material is applied to the top surface of the substrate and a vacuum is applied to the holes in the interacting member to pull the conductive material through the through holes in the substrate. The vacuum is then discontinued and the interacting member is moved back to a position where it is spaced from the bottom surface of the substrate.
    Type: Grant
    Filed: April 2, 1990
    Date of Patent: January 14, 1992
    Assignee: Delco Electronics Corporation
    Inventors: Joseph M. Zachman, Clyde E. Ragan, Steven L. Alexander, Bruce A. Myers, Charles T. Eytcheson