Abstract: In order to prevent bonding wire sag and to allow high lead count an insulative bridging member is provided between the ends of inner leads of a lead frame and a centrally mounted integrated circuit die. The bridging member of annular square configuration has transverse plated spaced conductive pathways. A first series of short bonding wires connect selected die contact pads to an inner end of selected conductive pathways and a second concentric series of bonding wires connect an outer end of the selective conductive pathways of the bridging member to selected ones of the inner leads of the lead frame. The above elements except for outer leads of the lead frame are encapsulated to form an overall die package with external leads or pin contacts.