Abstract: A three dimensional flexible assembly of integrated circuits and method of fabricating the assembly of circuits including a folded flexible substrate with integrated circuit chips. The invention has provisions for allowing mechanical and electrically functional attachment of integrated circuit chips to one or both sides of the flexible substrate using flip chip assembly techniques. In addition, a rigid package substrate is provided upon which the folded substrate is secured with the associated chips. The chips are electrically connected to the flexible substrate and the flexible substrate is in turn electrically connected to the rigid substrate. A cover is also provided that covers and protects the flexible substrate and the associated chips as well as a portion of the connected rigid package substrate. In an additional embodiment, the cover and rigid substrate are omitted and instead the combined folded flexible substrate and integrated circuit chips are encapsulated with a suitable compound.

Abstract: A three dimensional flexible assembly of integrated circuits and method of fabricating the assembly of circuits including a folded flexible substrate with integrated circuit chips. The invention has provisions for allowing mechanical and electrically functional attachment of integrated circuit chips to one or both sides of the flexible substrate using flip chip assembly techniques. In addition, a rigid package substrate is provided upon which the folded substrate is secured with the associated chips. The chips are electrically connected to the flexible substrate and the flexible substrate is in turn electrically connected to the rigid substrate. A cover is also provided that covers and protects the flexible substrate and the associated chips as well as a portion of the connected rigid package substrate In an additional embodiment, the cover and rigid substrate are omitted and instead the combined folded flexible substrate and integrated circuit chips are encapsulated with a suitable compound.