Abstract: A garment to be worn by a person has a first fabric panel having a first side edge and a second fabric panel having a second side edge. The first and second panels are joined by stitching to form a seam near the first and second side edges. An aperture is formed between the fabric panels by an interruption in the stitching. The aperture may be formed directly on the garment, or may be provided as a set-in that is attached to the garment. The aperture may be positioned on the garment so that it will be located under the arm of a person wearing the garment.

Abstract: The present invention relates to integrated circuits (ICs) fabrication and testing. Particularly, there is an IC pin/lead trimming and forming machine that is adapted to electrically test ICs for electrical defects. Uniquely, the IC testing can occur at any pin forming station after the IC pins or leads have been electrically isolated from each other and from other ICs on a lead frame. This arrangement will allow for testing of the individual ICs much sooner than has hereinbefore existed after undertaking the encapsulation process.

Abstract: An improved system for the production of semiconductor devices is described. The invention incorporates conventional, known die attach technology and tape automated bonding technology with known technology for the selective placement of electroconductive material upon a polymer film, which is then enclosed in the same film, to create a system whereby typical integrated circuit die can be simultaneously attached, physically and electrically, to typical lead frames and lead fingers and other lead terminals, to produce a highly reliable integrated circuit, with low inductance between the die and the lead terminals, which may then be encapsulated and trimmed and formed, in known ways, to complete the assembled package.

Abstract: An integrated system is described for testing, marking, inspecting and shipping completed semiconductor integrated circuit parts in a modified standard shipping tray by the combined use of a novel tray cover and an appropriately designed burn-in board assembly. A specially designed tray cover is placed on the modified shipping tray containing multiple integrated circuit parts which have been encapsulated and singulated. The cover is designed to hold the parts securely and precisely in specific individual location. Openings in the cover permit marking and inspecting of the parts by known means, when desired. A burn-in board is appropriately connected to the exposed leads of the parts, from beneath the tray and burn-in and other tests are conducted. Defective parts are identified and replaced. The special cover and burn-in board are removed from the shipping tray, which is then covered with a standard cover or stacked with other completed trays, to be stored or shipped.