Abstract: The invention covers a method of producing packaged batteries having high internal resistance utilizing semiconductor manufacturing techniques. These include forming an assembly for each battery to be formed of an anode plate and a cathode plate in spaced parallel relationship with a low concentration electrolyte in between the plates. The assembly is then arranged within a recess formed between upper and lower electrically conductive mold elements of a transfer mold. A temporary short circuit is thus created between the plates. The recess defines a battery package configuration. A plastic molding compound is then injected into the recess through a distribution aperture communication with the recess.