Patents by Inventor Steven L. Post

Steven L. Post has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multichip IC module having coplanar dice and substrate
    Patent number: 4890156
    Abstract: A multichip IC module having dice and substrates coplanarly bonded therein. After the dice are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the dice and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressued and cured on the surface of the dice and substrate. This film is used as a base for interconnect lines.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: December 26, 1989
    Assignee: Motorola Inc.
    Inventors: James E. Drye, Steven L. Post
  • Coplanar die to substrate bond method
    Patent number: 4792533
    Abstract: A method for bonding die to substrates coplanarly in a multichip module assembly. After the die are aligned into die openings of the substrate, a glass slurry is applied and the module is fired to solidify the glass. Because of shrinkage of the glass slurry firing, a groove results between the die and the substrate. To fill on this groove, a polyimide or like film is adhered and then pressed and cured on the surface of the die and substrate. This film is used as a base for interconnect lines.
    Type: Grant
    Filed: March 13, 1987
    Date of Patent: December 20, 1988
    Assignee: Motorola Inc.
    Inventors: James E. Drye, Steven L. Post