Abstract: Methods and systems for combining ablation therapy with navigation of the ablation device. An ablation system may be configured for use with one of two methods to prevent loss of navigation signals during ablation energy delivery. In the first method, ablation energy signals are filtered from the navigation signal. In the second method, the delivery of ablation energy is sequenced with the delivery of navigation energy such that ablation energy and navigation energy are not delivered at the same time and navigation signals received by the system are time-division multiplexed to reconstruct the navigation signals and determine a location of the device within the patient.

Abstract: An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.

Abstract: A solid or semi-solid thermoplastic adhesive adhered to a surface mount electronic device; an assembly made of at least a printed circuit board, a surface mount electronic device, solder joints providing a connection between the printed circuit board and the device, and solid thermoplastic adhesive joints attached to the device and the board. The thermoplastic adhesive is at least softened and applied to any available surface on the connecting substrate of the surface mounted electronic device. The thermoplastic adhesive is heated to a temperature sufficient to provide an adhesive joint between the organic surface and the board.

Abstract: An assembly having a surface mounted electronic device mounted onto a printed circuit board and a thermoplastic adhesive applied to the surface mounted electronic device facing the printed circuit board and providing for a gap between the thermoplastic adhesive and the printed circuit board. The assembly is heated at solder reflow temperatures to at least soften the thermoplastic adhesive sufficiently to flow across the gap and provide a thermoplastic adhesive joint between the surface mounted electronic device and the printed circuit board.

Abstract: A process is disclosed wherein two co-reactive resin streams are mixed immediately adjacent the entrance of an impregnation die used to make products by the pultrusion process. The mixing occurs immediately adjacent the fibers as they are pulled into the central duct opening of the die. The resin streams are delivered to the entrance of the impregnation die by use of a resin feed head positioned at the inlet of the impregnation die. An ultrasonic driver coupled to the resin feed head vibrates and agitates the resin streams impinging the fibers so as to thoroughly wet the fiber bundle prior to its passage through the die.

Abstract: Two co-reactive resin stream are mixed immediately adjacent the entrance of an impregnation die used to make products by the pultrusion process. The mixing occurs immediately adjacent the fibers as they are pulled into the central duct opening of the die. The resin streams are delivered to the entrance of the impregnation die by use of a resin feed head positioned at the inlet of the impregnation die. An ultrasonic driver coupled to the resin feed head vibrates and agitates the resin streams impinging the fibers so as to thoroughly wet the fiber bundle prior to its passage through the die.