Abstract: A prosthetic system for implantation between upper and lower vertebrae having an upper joint component and a lower joint component. The joint is adapted for implantation within a disc space between the upper and lower vertebrae, allowing the upper and lower vertebrae to move relative to one another. The system further includes a bridge component extending posteriorly from the lower joint component and from the disc space, with the bridge component having a lower contact surface configured for engaging a resected bone surface of a pedicle of the lower vertebrae. The distal end of the bridge component comprises a connection component adapted to receive a fastener.

Abstract: Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect and the physical mark in at least two dimensions. The wafer, an indication of the nominal location of the mark, and an indication of the distance between the detected defect and the mark are transferred to a material removal tool. The material removal tool (e.g., a focused ion beam (FIB) machining tool) removes material from the surface of the wafer above the buried defect until the buried defect is made visible to an electron-beam based measurement system. The electron-beam based measurement system is subsequently employed to further analyze the defect.

Abstract: Methods and systems for accurately locating buried defects previously detected by an inspection system are described herein. A physical mark is made on the surface of a wafer near a buried defect detected by an inspection system. In addition, the inspection system accurately measures the distance between the detected defect and the physical mark in at least two dimensions. The wafer, an indication of the nominal location of the mark, and an indication of the distance between the detected defect and the mark are transferred to a material removal tool. The material removal tool (e.g., a focused ion beam (FIB) machining tool) removes material from the surface of the wafer above the buried defect until the buried defect is made visible to an electron-beam based measurement system. The electron-beam based measurement system is subsequently employed to further analyze the defect.

Abstract: A multilevel vertical general aviation hangar, comprising a traffic inflow/outflow path and a pallet stack subsystem. There is also a pallet turntable located with the path. A pallet shuttle moves the pallet and contained vehicle from the turntable to a lift. The lift moves the pallet and vehicle to a predetermined location within a storage structure.

Abstract: The present invention relates to compositions including surfactant peroxycarboxylic acid, methods for making these compositions, and methods for reducing the population of a microorganism.

Abstract: Floor finishes can be stripped using a substantially nonchlorinated concentrate comprising a floor finish dissolver and an at least partially water-unactivated water thickener. The concentrate is diluted with water at an intended use location to activate the water thickener and noticeably increase within sixty minutes or less the viscosity of the resulting mixture, then applied to a hardened floor finish atop a floor and allowed to soften or dissolve the floor finish so that the finish may be removed from the floor.

Abstract: All-reflective optical systems for broadband wafer inspection are provided. One system configured to inspect a wafer includes an optical subsystem. All light-directing components of the optical subsystem are reflective optical components except for one or more refractive optical components, which are located only in substantially collimated space. The refractive optical component(s) may include, for example, a refractive beamsplitter element that can be used to separate illumination and collection pupils. The optical subsystem may also include one or more reflective optical components located in substantially collimated space. The optical subsystem is configured for inspection of the wafer across a waveband of greater than 20 nm. In some embodiments, the optical subsystem is configured for inspection of the wafer at wavelengths less than and greater than 200 nm.

Abstract: A method for limiting exposure of a substrate to potentially damaging radiation from a radiating apparatus. A database of information associated with the substrate is compiled, and the substrate is identified prior to processing the substrate on the radiating apparatus. The database of information associated with the substrate is accessed, including its past irradiation history of dosage and type of irradiation, based on the substrate identification, and the operation of the radiating apparatus is selectively modified based at least in part on the information associated with the substrate.

Abstract: This is a sealing material for filling a cavity of a pillar or another body member of an automobile. The material is a sealing acoustical baffle of a sandwich of foil faced paper board with an expandable sealant between the boards. The baffles force the sealer to flow out horizontally from the boards to totally seal all corners of the cavity. The in-line manufacturing of extruded laminated material allows in-line die cutting with quick change dies and/or water jet cutting. Acoustical value is very high due to the barrier affect of the foil kraft board. If the cavity size changes as they often do during pilot, prototype and production, the only tooling charge is a simple steel rule die or modified water jet program.