Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.

Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.

Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.

Abstract: A serial attached SCSI (SAS) system may include a host bus adaptor, a bus expander, and a multi-layer data transmission medium coupled between the host bus adaptor and the bus expander. The multi-layer data transmission medium may include a first microstrip structure located at a top surface portion of the multi-layer data transmission medium and a first stripline structure located within a first internal portion of the multi-layer data transmission medium. The microstrip structure provides, among other things, a repeaterless high-speed serial communications link between the host bus adaptor and the bus expander.

Abstract: A serial attached SCSI (SAS) system may include a host bus adaptor, a bus expander, and a multi-layer data transmission medium coupled between the host bus adaptor and the bus expander. The multi-layer data transmission medium may include a first microstrip structure located at a top surface portion of the multi-layer data transmission medium and a first stripline structure located within a first internal portion of the multi-layer data transmission medium. The microstrip structure provides, among other things, a repeaterless high-speed serial communications link between the host bus adaptor and the bus expander.