Abstract: A bonding apparatus and method of bonding copper bond wires to bond pads on an integrated circuit devices attached to a substrate. A heater block heats the devices and substrate prior to and during wire bonding. A clamp presses the substrate down onto the heater block during wire bonding and thereby forms a region of the substrate isolated from the remainder of the substrate. A bonder head creates ball bonds as it attaches one end of the bond wires to the bond pads on the devices within the isolated region. The bonder head also attaches the other end of the bond wires to substrate pads adjacent the devices being wire bonded. To prevent corrosion of the ball bonds, a gas source floods the substrate and the attached devices that have not yet wire bonded with a purge gas while the heater block heats the substrate and the attached devices.