Patents by Inventor Steven Ly

Steven Ly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11915747
    Abstract: Numerous examples for performing tuning of a page or a word of non-volatile memory cells in an analog neural memory are disclosed. In one example, an analog neural memory system comprises an array of non-volatile memory cells arranged into rows and columns, each non-volatile memory cell comprising a word line terminal, a bit line terminal, and an erase gate terminal; a plurality of word lines, each word line coupled to word line terminals of a row of non-volatile memory cells; a plurality of bit lines, each bit line coupled to bit line terminals of a column of non-volatile memory cells; and a plurality of erase gate enable transistors, each erase gate enable transistor coupled to erase gate terminals of a word of non-volatile memory cells.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: February 27, 2024
    Assignee: SILICON STORAGE TECHNOLOGY, INC.
    Inventors: Hieu Van Tran, Thuan Vu, Stephen Trinh, Stanley Hong, Anh Ly, Steven Lemke, Vipin Tiwari, Nhan Do
  • Publication number: 20230177469
    Abstract: Techniques are disclosed for segmenting users based on user interactions with messages transmitted over various electronic communication channels. In some embodiments, a segmentation application normalizes sets of event data associated with user interactions with messages that are transmitted over multiple electronic communication channels to generate intermediate labels associated with the sets of event data. The normalization includes applying a time decay while accounting for messaging cadence, messaging volume, and user interactions with messages associated with an industry. The intermediate labels are combined to generate a final label associated with the user via a pairwise combination technique that maintains a more favorable label when a pair of intermediate labels are combined. Additional messages can then be generated and/or transmitted based on the final label.
    Type: Application
    Filed: December 7, 2021
    Publication date: June 8, 2023
    Inventors: Ankit AWASTHI, Ayush AGARWAL, Steven LY, Praateek MAHAJAN, Wayne COBURN
  • Publication number: 20060032848
    Abstract: A process and system for heating semiconductor substrates in a processing chamber on a susceptor as disclosed. In accordance with the present invention, the susceptor includes a support structure made from a material having a relatively low thermal conductivity for suspending the wafer over the susceptor. The support structure has a particular height that inhibits or prevents radial temperature gradients from forming in the wafer during high temperature processing. If needed, recesses can be formed in the susceptor for locating and positioning a support structure. The susceptor can include a wafer supporting surface defining a pocket that has a shape configured to conform to the shape of a wafer during a heat cycle.
    Type: Application
    Filed: October 18, 2005
    Publication date: February 16, 2006
    Inventors: Young Lee, Ronald Wang, Steven Ly, Daniel Devine
  • Publication number: 20030209326
    Abstract: A process and system for heating semiconductor substrates in a processing chamber on a susceptor as disclosed. In accordance with the present invention, the susceptor includes a support structure made from a material having a relatively low thermal conductivity for suspending the wafer over the susceptor. The support structure has a particular height that inhibits or prevents radial temperature gradients from forming in the wafer during high temperature processing. If needed, recesses can be formed in the susceptor for locating and positioning a support structure. The susceptor can include a wafer supporting surface defining a pocket that has a shape configured to conform to the shape of a wafer during a heat cycle.
    Type: Application
    Filed: May 7, 2002
    Publication date: November 13, 2003
    Applicant: Mattson Technology, Inc.
    Inventors: Young Jai Lee, Ronald L. Wang, Steven Ly, Daniel J. Devine