Abstract: Integrated circuit packages that may be easily stacked one on top of the other are disclosed. The package includes a molded plastic body having metal-coated interconnection posts on both its upper and lower surfaces. An integrated circuit is mounted on the upper surface. Metal traces on the upper surface electrically connect each bonding pad on the integrated circuit to a one of a plurality of groups of four interconnection posts on the upper surface. Vias through the substrate electrically connect each group of four posts on the upper surface to an interconnection post on the lower surface of the package. Two or more packages can be stacked and electrically connected by wedging the lower posts of a top package between each group of four posts on the upper surface of a lower package. The lower posts of the lower package may be soldered to a conventional printed circuit board, or may be mounted on a mounting substrate that also has corresponding groups of four interconnection posts.

Abstract: An intravascular catheter that exhibits the combined features of superior flexibility, softness, radiopacity and oval/kink resistance. The catheter includes an elongate shaft having a proximal region, a distal region and a lumen extending therethrough. The proximal region of the shaft includes an inner lubricious polymer layer, a reinforcement layer and an outer layer. The reinforcement layer comprises a braid having one or more metallic members and a plurality of polymer members wherein each polymer member comprises a plurality of monofilaments, preferably formed of LCP. The polymer members of the braid provide improved flexibility and softness in addition to high burst pressure. The metallic member(s) of the braid provide improved radiopacity and oval/kink resistance. The catheter may also include a longitudinal member extending along the reinforcement layer.

Abstract: An intravascular catheter that exhibits the combined features of superior flexibility, softness, radiopacity and oval/kink resistance. The catheter includes an elongate shaft having a proximal region, a distal region and a lumen extending therethrough. The proximal region of the shaft includes an inner lubricious polymer layer, a reinforcement layer and an outer layer. The reinforcement layer comprises a braid having one or more metallic members and a plurality of polymer members wherein each polymer member comprises a plurality of monofilaments, preferably formed of LCP. The polymer members of the braid provide improved flexibility and softness in addition to high burst pressure. The metallic member(s) of the braid provide improved radiopacity and oval/kink resistance. The catheter may also include a longitudinal member extending along the reinforcement layer.

Abstract: A module of electrically interconnected integrated circuit packages and methods of making the module are disclosed. The module includes at least first and second integrated circuit packages, each of which are comprised of a package body formed of an encapsulant material. A plurality of leads extend from the package bodies of the first and second packages. The leads are bent into a C-shape. Keys and keyholes in the package bodies allow the packages to be stacked one on top of the other. One or more leads of the first package are electrically connected to one or more leads of the second package through an interposer that is positioned between the first and second packages. The interposer includes conductive paths that enable the electrical connection of leads of the first and second packages in cases where the leads to be interconnected are displaced from one and other.

Abstract: The present invention provides a method of using a getter layer on a semiconductor substrate having a first metal stack formed thereon to improve metal to metal contact resistance. The method comprises the steps of forming a getter layer, which may be titanium, on the first metal stack, wherein the getter layer has a higher affinity for oxygen or a higher getter capability than the first metal stack, substantially removing the getter layer by exposing the getter layer to radiation, and forming a second metal stack, which in an advantageous embodiment may also be titanium, on the first metal stack.

Abstract: An intravascular catheter that exhibits the combined features of superior flexibility, softness, radiopacity and oval/kink resistance. The catheter includes an elongate shaft having a proximal region, a distal region and a lumen extending therethrough. The proximal region of the shaft includes an inner lubricious polymer layer, a reinforcement layer and an outer layer. The reinforcement layer comprises a braid having one or more metallic members and a plurality of polymer members wherein each polymer member comprises a plurality of monofilaments, preferably formed of LCP. The polymer members of the braid provide improved flexibility and softness in addition to high burst pressure. The metallic member(s) of the braid provide improved radiopacity and oval/kink resistance. The catheter may also include a longitudinal member extending along the reinforcement layer.

Abstract: The present invention provides a method of using a getter layer on a semiconductor substrate having a first metal stack formed thereon to improve metal to metal contact resistance. The method comprises the steps of forming a getter layer, which may be titanium, on the first metal stack, wherein the getter layer has a higher affinity for oxygen or a higher getter capability than the first metal stack, substantially removing the getter layer by exposing the getter layer to radiation, and forming a second metal stack, which in an advantageous embodiment may also be titanium, on the first metal stack.

Abstract: A method and apparatus for authenticating the identity of a remote user entity where the identity of such user entity is authenticated by use of information specific to geodetic location of the user entity but that changes constantly, making "spoofing" the host device extremely difficult. The invention is preferably implemented utilizing satellite positioning technology to produce the identifying information.