Patents by Inventor Steven M. Bunyan

Steven M. Bunyan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11139407
    Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: October 5, 2021
    Assignee: The Boeing Company
    Inventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
  • Publication number: 20190148572
    Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.
    Type: Application
    Filed: January 16, 2019
    Publication date: May 16, 2019
    Applicant: The Boeing Company
    Inventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
  • Patent number: 10224440
    Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: March 5, 2019
    Assignee: The Boeing Company
    Inventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
  • Publication number: 20170222070
    Abstract: A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.
    Type: Application
    Filed: April 17, 2017
    Publication date: August 3, 2017
    Applicant: The Boeing Company
    Inventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut
  • Publication number: 20130240009
    Abstract: A solar cell assembly including a semiconductor wafer having a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and an electrical contact material positioned on the solar cell portion, wherein the wing portion is substantially free of the electrical contact material.
    Type: Application
    Filed: March 18, 2012
    Publication date: September 19, 2013
    Applicant: The Boeing Company
    Inventors: Xiaobo Zhang, Vincent A. Lim, Hoon H. Lee, John P. Serra, Uming T. Jeng, Steven M. Bunyan, Julie J. Hoskin, Kent E. Barbour, Dimitri D. Krut