Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: A system includes a laser-diode bar comprising an emitting surface and a reflective surface opposing the emitting surface. The laser-diode bar includes a positive-side surface and a negative-side surface opposing the positive-side surface for conducting electrical energy through laser-diode bar. The system also includes a heat sink thermally coupled to the laser-diode bar. The heat sink is made of a material selected from the group consisting of Skeleton-cemented diamond and diamond-copper composite. The system also includes a heat spreader interposed between the heat sink and the laser-diode bar. The heat spreader includes a first surface thermally interfacing the positive-side surface of the laser-diode bar. The first surface is substantially smoother than a surface on the heat sink and includes an electrically conductive material for conducting the electrical energy into the laser-diode bar.

Abstract: A laser diode package includes a laser diode, a cooler, and a metallization layer. The laser diode is used for converting electrical energy to optical energy. The cooler receives and routes a coolant from a cooling source via internal channels. The cooler includes a plurality of ceramic sheets and a highly thermally-conductive sheet. The ceramic sheets are fused together and the thermally-conductive sheet is attached to a top ceramic sheet of the plurality of ceramic sheets. The metallization layer has at least a portion on the thermally-conductive sheet. The portion is electrically coupled to the laser diode for conducting the electrical energy to the laser diode.

Abstract: The present invention relates to a method for producing a low temperature 0-3 composite material, comprising the steps of providing a mixture, wherein the mixture comprises a liquid phase and a particulate phase and wherein the liquid phase comprises a reactive metal alkoxide; depositing the mixture on to a plastic substrate; and consolidating the mixture to provide a 0-3 composite material, wherein the 0-3 composite material is suitable for use as an electronic component.

Abstract: Sol-gel-derived “0-3 composite” ceramics are provided for application to electronics components directly written onto low-temperature substrates. The 0-3 composite materials are prepared from a mixture of liquid-phase and solid-phase constituents, as are the pastes conventionally used to prepare thick-film materials for the electronics industry. The prepared 0-3 composites exhibit several advantages, including substantial reductions in (1) processing temperatures, (2) solvent concentrations, and (3) organic post-processing-residual concentrations. In addition, the rapid removal of solvent during application is compatible with such rapid prototyping methods as laser densification. The 0-3 composites may be deposited onto plastic substrates while still meeting expected performance standards. Therefore, the direct writing of electronics components onto such low-temperature substrates as plastic may be achieved using sol-gel-based 0-3 composites.