Abstract: A tool for removing resist material from the sides of conductive boards such as circuit boards wherein it is necessary to remove resist material which covers and surrounds passages which are provided through the conductive board. The tool includes a surface plate to support the board, a light source below the plate, a vertically shiftable cutting tool arranged below the surface plate and an inspection unit for visual and electronic inspection of the passage location mounted above the surface plate. Light passing from below the surface plate will be visible to the inspection unit as a board passage is located over the center of the cutting tool with the light passing through the supporting surface plate, the resist material and the board passage. When the passage is properly located, a clamp device is actuated to positively clamp the board into proper cutting position for removal of the resist material from the bottom side thereof.