Abstract: An improved pitch and roll mechanism is disclosed herein which provides for increased flexibility, stability, and accuracy of motion in positioning a miniaturized electronic component in a flip chip bonding system. The pitch and roll mechanism generally includes a pitch axis assembly comprising a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned pitch axis bearing surfaces. In addition, a roll axis assembly, mounted at a right angle, or perpendicularly, to the pitch axis assembly, is provided. The roll axis assembly typically includes a plurality of bearing surfaces, each possessing a circular curvature, and at least one roller bearing in operative contact with at least one of the aforementioned roll axis bearing surfaces. The curvatures of the pitch and roll axis bearing surfaces are such that a single, coincident center of rotation for both the pitch and roll axis assemblies is created.