Patents by Inventor Steven M. Toller

Steven M. Toller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10365479
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: July 30, 2019
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Publication number: 20180321485
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Application
    Filed: July 12, 2018
    Publication date: November 8, 2018
    Applicant: LSP TECHNOLOGIES, INC.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 10048494
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: August 14, 2018
    Assignee: LSP TECHNOLOGIES, INC.
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 9227268
    Abstract: Methods, systems, and apparatuses are disclosed for improving fatigue strength and damage tolerance of metal materials. For example, a system is provided for laser shock peening a metal material, the system comprising: a momentum trap material; a laser; an actuator, capable of pressing the momentum trap material into intimate contact with a first side of the metal material; and an advancer, capable of advancing the momentum trap material relative to the first side of the metal material.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: January 5, 2016
    Assignee: LSP Technologies, Inc.
    Inventors: Nickolas K. McCoy, Jeff L. Dulaney, Steven M. Toller
  • Publication number: 20150143916
    Abstract: Methods, systems, and apparatuses are disclosed for the protection of optical components used during laser bond inspection. In one embodiment, an optic surface wetting enhancement is provided on a protective optic to assist in forming a substantially flat film of transparent liquid from transparent liquid applied to a surface of a protective optic. A flat film of transparent liquid on a surface of a protective optic may be used to retain debris and effluent backscatter produced during a laser bond inspection process.
    Type: Application
    Filed: November 25, 2014
    Publication date: May 28, 2015
    Inventors: Steven M. Toller, David Sokol, Mark E. O'Loughlin, Jeff L. Dulaney
  • Patent number: 8785814
    Abstract: Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: July 22, 2014
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Ronald L. Johnson
  • Patent number: 8225664
    Abstract: Exemplary embodiments are disclosed for the use of Lamb waves in laser bond inspection.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: July 24, 2012
    Assignee: LSP Technologies
    Inventors: David W. Sokol, Craig T. Walters, Kevin R. Housen, Richard H. Bossi, Steven M. Toller
  • Patent number: 8156811
    Abstract: A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.
    Type: Grant
    Filed: September 15, 2005
    Date of Patent: April 17, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Craig T. Walters
  • Patent number: 8132460
    Abstract: Methods, systems, and apparatuses are provided for creating bond delaminations in a controlled fashion within adhesively bonded structures. In one embodiment, a system for inducing a defect in a bond of a bonded article includes a laser and a laser processor head. The laser processor head includes a housing, a lens disposed within the housing, at least one magnet disposed within the housing, and at least one sensor disposed within the housing. The system is capable of applying a laser pulse of sufficient energy fluence to cause localized weaknesses in the bond.
    Type: Grant
    Filed: May 5, 2009
    Date of Patent: March 13, 2012
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Jeff L. Dulaney
  • Patent number: 7775122
    Abstract: Tape overlays for use in laser bond inspection are provided, as well as laser bond inspection systems and methods utilizing tape overlays.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: August 17, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, David W. Sokol, Craig T. Walters
  • Patent number: 7776165
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: August 29, 2008
    Date of Patent: August 17, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: Jeff L. Dulaney, Steven M. Toller, Allan H. Clauer
  • Patent number: 7770454
    Abstract: A system for evaluating the integrity of a bonded joint in an article includes a laser configured in a laser shock processing arrangement to perform a laser shock processing treatment on the article. A beam delivery system employs an articulated arm assembly to communicate the radiant energy emitted by the laser to a process head proximate the article. The laser shock processing treatment causes the formation of shockwaves that propagate through the article, inducing internal stress wave activity that characteristically interacts with the bonded joint. A sensor detects a stress wave signature emanating from the article, which is indicative of the integrity of the bond. A detector such as a non-contact electromagnetic acoustic transducer provides a measure of the stress wave signature in the form of surface motion measurements.
    Type: Grant
    Filed: September 27, 2004
    Date of Patent: August 10, 2010
    Assignee: LSP Technologies, Inc.
    Inventors: David W. Sokol, Craig T. Walters, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 7735377
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: June 15, 2010
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Steven M. Toller, Richard H. Bossi, Kevin R. Housen
  • Patent number: 7509876
    Abstract: Methods, systems, and apparatuses are provided for generation of focused stress waves that selectively apply tensile stress to local regions of a bonded article.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: March 31, 2009
    Assignees: LSP Technologies, Inc., The Boeing Company
    Inventors: David W. Sokol, Craig T. Walters, Kevin R. Houson, Richard H. Bossi, Steven M. Toller
  • Patent number: 7470335
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: December 27, 2004
    Date of Patent: December 30, 2008
    Assignee: LSP Technologies, Inc.
    Inventors: Steven M. Toller, Allan H. Clauer, Jeff L. Dulaney
  • Publication number: 20080257048
    Abstract: A diagnostic means to enable real-time inspection of bonded structures. The disclosed apparatus detects bond failure stress waves on-axis from the front side (beam application side). Pi-box and pi-rail EMAT gauges can be used with the disclosed apparatus. An inductively coupled EMAT may also be employed. An improved means to remotely deliver an interrogating laser beam to a surface is provided. The process head may utilize a water column or a water film. The water film process head may include the use of either a single water film or two spaced apart water films. The disclosed apparatus can be used with bonded composite structures, bonded structures using various materials, and to determine the dynamic strength of unbonded solid materials. The apparatus may also be used in other applications that require remote flexible delivery of a localized stress wave to a material and/or diagnosis of the resultant stress waves.
    Type: Application
    Filed: September 15, 2005
    Publication date: October 23, 2008
    Inventors: Craig T. Walters, Steven M. Toller
  • Patent number: 6875953
    Abstract: Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.
    Type: Grant
    Filed: September 12, 2003
    Date of Patent: April 5, 2005
    Assignee: LSP Technologies, Inc.
    Inventors: Allan H. Clauer, David F. Lahrman, Jeff L. Dulaney, Steven M. Toller
  • Patent number: 6852179
    Abstract: A method of manufacturing a workpiece involves performing any one of various post-processing part modification steps on a workpiece that has been previously subjected to laser shock processing. In one step, material is removed from the compressive residual stress region of the processed workpiece. Alternately, the workpiece may be provided with oversized dimensions such that the removal process removes an amount of material sufficient to generate a processed workpiece having dimensions substantially conforming to design specifications. Alternately, the material removal process is adapted to establish a penetration depth for material removal that coincides with the depth at which the workpiece exhibits maximum compressive residual stress. Alternately, a first high-intensity laser shock processing treatment is performed on the workpiece, followed by the removal of material from the compressive residual stress region, and then a second low-intensity laser shock processing treatment is performed on the workpiece.
    Type: Grant
    Filed: June 9, 2000
    Date of Patent: February 8, 2005
    Assignee: LSP Technologies Inc.
    Inventors: Steven M. Toller, Allan H. Clauer, Jeff L. Dulaney
  • Publication number: 20040238509
    Abstract: Various laser shock processing methods are provided to establish selective compressive residual stress distribution profiles within a workpiece. An asymmetrical stress distribution profile may be formed through the thickness of a thin section of a gas turbine engine airfoil. One method involves simultaneously irradiating a workpiece with a set of laser beams to form a corresponding set of adjacent non-overlapping laser shock peened surfaces, enabling the shockwaves to encounter one another. Additionally, opposite sides of the workpiece may be irradiated at different times to form opposing laser shock peened surfaces, enabling the shockwaves to meet at a location apart from the mid-plane. Furthermore, opposite sides of the workpiece may be irradiated simultaneously using laser beams having different pulse lengths to form opposing laser shock peened surfaces. Moreover, opposite sides of the workpiece may be irradiated simultaneously to form a set of laterally offset laser shock peened surfaces.
    Type: Application
    Filed: September 12, 2003
    Publication date: December 2, 2004
    Inventors: Allan H. Clauer, David F. Lahrman, Jeff L. Dulaney, Steven M. Toller
  • Publication number: 20040226637
    Abstract: A laser shock processing treatment is employed to condition the mating surfaces of various fastener elements, such as screws, bolts, splines, keys, and keyways. In a screw, for example, the threaded surface is laser shock processed to form laser shock processed surfaces at the thread root portion of the screw. Regions of compressive residual stresses imparted by laser shock processing are thereby formed and extend into the screw body from the laser shock processed surfaces. In a keyway, for example, the keyway surface is laser shock processed to form laser shock processed surfaces within the keyway. Regions of compressive residual stresses imparted by laser shock processing are thereby formed and extend into the keyway body from the laser shock processed surfaces. The compressive residual stress regions enhance the rigidity and torsional stiffness of the fastener elements and improve their fatigue properties.
    Type: Application
    Filed: May 13, 2003
    Publication date: November 18, 2004
    Applicant: LSP Technologies, Inc.
    Inventors: Jeff L. Dulaney, Allan H. Clauer, Steven M. Toller