Abstract: Microscale and/or nanoscale structural features are formed in material by using an ultrashort pulsed laser (e.g., a femtosecond pulsed laser). Methods of forming such structures comprise applying laser energy generated by an ultrashort pulsed laser to a surface of a substrate having a first layer and a distinct second layer. The first layer has a first ablation threshold that is less than the applied laser energy and the second layer has a second ablation threshold that is greater than the applied laser energy. The laser energy penetrates through the second layer to the first layer. The applied laser energy results in damage (or an ablation event) at the first layer that exerts force sufficient to delaminate the second layer, thereby forming a void space that is a channel having a major elongate axis or alternately forming an open groove.