Patents by Inventor Steven Madara

Steven Madara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10465963
    Abstract: A cooling system has both pumped refrigerant economization and direct expansion cooling. When outside air temperature is low enough that pumped refrigerant economization can provide enough cooling to satisfy cooling demand, only pumped refrigerant economization cooling is used to provide cooling. When outside air temperature is low enough that pumped refrigerant economization can provide some but not all of the cooling needed to satisfy cooling demand, the pumped refrigerant economization is operated at one hundred percent capacity and the direct expansion cooling is operated at a capacity to provide any supplemental cooling that is needed. If the outside air temperature is high enough that pumped refrigerant economization cannot provide any cooling, then only direct expansion cooling is used to provide cooling.
    Type: Grant
    Filed: February 20, 2019
    Date of Patent: November 5, 2019
    Assignee: Vertiv Corporation
    Inventors: Zhiyong Lin, Steven Madara, Benedict J. Dolcich, Stephen Sillato, Daniel J. SChutte
  • Publication number: 20190178546
    Abstract: A cooling system has both pumped refrigerant economization and direct expansion cooling. When outside air temperature is low enough that pumped refrigerant economization can provide enough cooling to satisfy cooling demand, only pumped refrigerant economization cooling is used to provide cooling. When outside air temperature is low enough that pumped refrigerant economization can provide some but not all of the cooling needed to satisfy cooling demand, the pumped refrigerant economization is operated at one hundred percent capacity and the direct expansion cooling is operated at a capacity to provide any supplemental cooling that is needed. If the outside air temperature is high enough that pumped refrigerant economization cannot provide any cooling, then only direct expansion cooling is used to provide cooling.
    Type: Application
    Filed: February 20, 2019
    Publication date: June 13, 2019
    Applicant: Vertiv Corporation
    Inventors: Zhiyong LIN, Steven MADARA, Benedict J. DOLCICH, Stephen SILLATO, Daniel J. SCHUTTE
  • Patent number: 10254028
    Abstract: A cooling system has both pumped refrigerant economization and direct expansion cooling. When outside air temperature is low enough that pumped refrigerant economization can provide enough cooling to satisfy cooling demand, only pumped refrigerant economization cooling is used to provide cooling. When outside air temperature is low enough that pumped refrigerant economization can provide some but not all of the cooling needed to satisfy cooling demand, the pumped refrigerant economization is operated at one hundred percent capacity and the direct expansion cooling is operated at a capacity to provide any supplemental cooling that is needed. If the outside air temperature is high enough that pumped refrigerant economization cannot provide any cooling, then only direct expansion cooling is used to provide cooling.
    Type: Grant
    Filed: June 8, 2016
    Date of Patent: April 9, 2019
    Assignee: Vertiv Corporation
    Inventors: Zhiyong Lin, Steven Madara, Benedict J. Dolcich, Stephen Sillato, Daniel J. Schutte
  • Publication number: 20160363359
    Abstract: A cooling system has both pumped refrigerant economization and direct expansion cooling. When outside air temperature is low enough that pumped refrigerant economization can provide enough cooling to satisfy cooling demand, only pumped refrigerant economization cooling is used to provide cooling. When outside air temperature is low enough that pumped refrigerant economization can provide some but not all of the cooling needed to satisfy cooling demand, the pumped refrigerant economization is operated at one hundred percent capacity and the direct expansion cooling is operated at a capacity to provide any supplemental cooling that is needed. If the outside air temperature is high enough that pumped refrigerant economization cannot provide any cooling, then only direct expansion cooling is used to provide cooling.
    Type: Application
    Filed: June 8, 2016
    Publication date: December 15, 2016
    Inventors: Zhiyong LIN, Steven MADARA, Benedict J. DOLCICH, Stephen SILLATO, Daniel J. SCHUTTE
  • Publication number: 20150216087
    Abstract: A method of retrofitting a computer room air conditioner having a direct expansion refrigeration circuit to increase a maximum temperature delta of the computer room air conditioner includes adding an upstream cooling circuit that is a pumped refrigerant cooling circuit having a cooling coil disposed upstream of a cooling coil of the direct expansion refrigeration circuit. Air to be cooled is passed in serial fashion across the cooling coil of the upstream cooling circuit and then the cooling coil of the direct expansion refrigeration circuit. The upstream cooling circuit is controlled to cool the air flowing across the cooling coil of the upstream cooling circuit to provide only sensible cooling and so that a temperature of the upstream cooling coil is always above a dewpoint of the air flowing across the upstream cooling coil. The direction direct expansion refrigeration circuit is controlled to provide any latent cooling that is needed.
    Type: Application
    Filed: April 13, 2015
    Publication date: July 30, 2015
    Applicant: LIEBERT CORPORATION
    Inventors: Steven MADARA, Thomas HARVEY
  • Publication number: 20120174612
    Abstract: A computer room air conditioner (“CRAC”) has a cabinet having an air inlet through which return air from an area is drawn and an air outlet through which air cooled by the CRAC is exhausted. An air moving unit is disposed in the cabinet as are a plurality of cooling coils, which are in separate cooling circuits. The cooling coils are arranged so that the air passes through the cooling coils in serial fashion, that is, first through an upstream cooling coil and then through a downstream cooling cool. The upstream cooling coil acts as a pre-cooler to the subsequent downstream cooling coil. The CRAC includes a controller that controls the cooling provided by the cooling circuits. The controller controls the cooling provided by the upstream cooling circuit so that when it is being used to provide cooling, it provides only sensible cooling.
    Type: Application
    Filed: May 13, 2011
    Publication date: July 12, 2012
    Applicant: Liebert Corporation
    Inventors: Steven Madara, Thomas Harvey
  • Publication number: 20080251240
    Abstract: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
    Type: Application
    Filed: March 20, 2008
    Publication date: October 16, 2008
    Applicant: LIEBERT CORPORATION
    Inventors: Steven Madara, Stephen Sillato, Thomas Harvey, Daniel Baer
  • Patent number: 7367384
    Abstract: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: May 6, 2008
    Assignee: Liebert Corporation
    Inventors: Steven Madara, Stephen Sillato, Thomas Harvey, Daniel Baer
  • Publication number: 20070030650
    Abstract: The disclosure provides an improved cooling system and associated cabinet for electronic equipment, and optionally, a backup ventilation system for cooling related failures. Generally, the disclosure includes a high capacity closed loop refrigeration system in a modified cabinet, while accommodating standard sized computer equipment. Further, the system provides directed heat removal by altering typical airflow paths within the cabinet. The backup ventilation system is powered by auxiliary power in the case of power failure and uses the same fan(s) for ventilation as is used for cooling. The disclosure provides a more efficient, higher capacity cooling cabinet in less space than otherwise known in the art. Further, the cooling system can anticipate heat loads and therefore operate in a predictive capacity by monitoring input power to the electronic equipment and adjusting the cooling for the expected increase or decrease in heat load generated based on the input power.
    Type: Application
    Filed: July 20, 2006
    Publication date: February 8, 2007
    Applicant: LIEBERT CORPORATION
    Inventors: Steven MADARA, Steve SILLATO, Thomas HARVEY, David DUKES
  • Publication number: 20060102322
    Abstract: A system for cooling heat-generating objects, such as computer boards situated in a rack, includes an enclosure in which the heat generating objects are situated. The enclosure has an air inlet and an air outlet, and a fan induces airflow into the air inlet, through the enclosure and out the air outlet. A heat exchanger is situated in the enclosure such that the heat exchanger is in a spaced apart relationship with the heat-generating object. Air moving through or past the heat-generating object is warmed, and the heat exchanger removes the heat before the air exits the enclosure.
    Type: Application
    Filed: November 14, 2005
    Publication date: May 18, 2006
    Applicant: LIEBERT CORP.
    Inventors: Steven MADARA, Stephen SILLATO, Thomas HARVEY, Daniel Baer
  • Publication number: 20050120737
    Abstract: A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
    Type: Application
    Filed: December 2, 2004
    Publication date: June 9, 2005
    Inventors: Steven Borror, Franklin DiPaolo, Thomas Harvey, Steven Madara, Reasey Mam, Stephen Sillato