Patents by Inventor Steven Mak

Steven Mak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100230476
    Abstract: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
    Type: Application
    Filed: May 27, 2010
    Publication date: September 16, 2010
    Applicant: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Steven Mak, E. Walter Frasch
  • Publication number: 20070251980
    Abstract: A wire bonding machine is provided. The wire bonding machine includes (1) a bond site area for holding a semiconductor device during a wire bonding operation, and (2) a gas supply line configured to provide a gas at the bond site area from above the bond site area.
    Type: Application
    Filed: April 26, 2006
    Publication date: November 1, 2007
    Inventors: Gary Gillotti, Steven Mak, E. Frasch
  • Patent number: 5384009
    Abstract: A process for selectively etching a substrate, having grain boundaries and a resist material thereon, is described. The substrate is placed into an etch zone and a process gas comprising a primary etchant, a secondary etchant, and xenon is introduced into the etch zone. A plasma is generated in the zone to form an etch gas from the process gas, that substantially anisotropically etches the substrate at fast rates, with good selectivity, and reduced profile microloading. Preferably the primary etchant comprises Cl.sub.2, and the secondary etchant comprises BCl.sub.3.
    Type: Grant
    Filed: June 16, 1993
    Date of Patent: January 24, 1995
    Assignee: Applied Materials, Inc.
    Inventors: Steven Mak, Brian Shieh, Charles S. Rhoades