Abstract: An assembly process using liquid optically clear adhesive for support of thin components. The method comprising the steps of placing a release liner and substrate, determining the placement location of the embedding material, positioning the embedding material on the determined placement location, applying a first LOCA, sandwiching the embedding material between the contact side of the substrate and the release side of the release liner to create an initial assembly, curing the first LOCA, removing the release liner, securing the substrate onto a cutting mat with the embedding material and first LOCA facing up, cutting a detailed design, transferring the initial assembly to the work surface, removing unwanted embedding material, applying a second LOCA, sandwiching the detailed design, curing the second LOCA, cleaning the final assembly, and trimming the edges of the final assembly to the size and shape of a final product.