Patents by Inventor Steven Mark Anderson

Steven Mark Anderson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040106279
    Abstract: A system and method for eliminating interconnect extrusions in vias that are formed during ionized metal plasma processing. By eliminating interconnect extrusions in vias, reliability failures and yield loss are decreased. The extrusions of interconnect metallization occur while wafers are subject to elevated temperatures that cause the internal stresses in the interconnect metallization to transit from a substantially tensile mode to a substantially compressive mode. By controlling the interconnect temperature to be below the temperature at which the interconnect transits from a tensile to a compressive mode, interconnect extrusions in vias are eliminated. The interconnect temperature is controlled by using an actively cooled pedestal in combination with a low temperature IMP deposition process. In addition, the IMP processing time may also be decreased to limit heating of the interconnect.
    Type: Application
    Filed: November 12, 2003
    Publication date: June 3, 2004
    Inventors: Steven Mark Anderson, Siddhartha Bhowmik, Joseph William Buckfeller, Sailesh Mansinh Merchant, Frank Minardi
  • Patent number: 6720261
    Abstract: A system and method for eliminating interconnect extrusions in vias that are formed during ionized metal plasma processing. By eliminating interconnect extrusions in vias, reliability failures and yield loss are decreased. The extrusions of interconnect metallization occur while wafers are subject to elevated temperatures that cause the internal stresses in the interconnect metallization to transit from a substantially tensile mode to a substantially compressive mode. By controlling the interconnect temperature to be below the temperature at which the interconnect transits from a tensile to a compressive mode, interconnect extrusions in vias are eliminated. The interconnect temperature is controlled by using an actively cooled pedestal in combination with a low temperature IMP deposition process. In addition, the IMP processing time may also be decreased to limit heating of the interconnect.
    Type: Grant
    Filed: June 2, 2000
    Date of Patent: April 13, 2004
    Assignee: Agere Systems Inc.
    Inventors: Steven Mark Anderson, Siddhartha Bhowmik, Joseph William Buckfeller, Sailesh Mansinh Merchant, Frank Minardi
  • Patent number: 5704862
    Abstract: This invention relates to dual-sided multi-ribbed power transmission belts having a plurality of longitudinally extending, transversely spaced alternating ribs and grooves with the ribs having a distance between their midpoints of a pitch P on both sides of the belt. The grooves on opposite sides of the belt are transversely offset from each by a distance of P/2.
    Type: Grant
    Filed: January 13, 1997
    Date of Patent: January 6, 1998
    Assignee: The Goodyear Tire & Rubber Company
    Inventors: Michel Leroy Janne, Steven Mark Anderson