Patents by Inventor Steven Mark Buchoff

Steven Mark Buchoff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated silicidation for improved SiC processing and device yield
    Patent number: 7790616
    Abstract: A method for producing a silicide contact. The method comprises the steps of depositing a metal on a SiC substrate; forming an encapsulating layer on deposited metal; and annealing said deposited metal to form a silicide contact. The encapsulating layer prevents agglomeration and formation of stringers during the annealing process.
    Type: Grant
    Filed: August 29, 2007
    Date of Patent: September 7, 2010
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Steven Mark Buchoff, Andrew Christian Loyd, Robert S. Howell
  • Encapsulated silicidation for improved SiC processing and device yield
    Publication number: 20090057906
    Abstract: A method for producing a silicide contact. The method comprises the steps of depositing a metal on a SiC substrate; forming an encapsulating layer on deposited metal; and annealing said deposited metal to form a suicide contact. The encapsulating layer prevents agglomeration and formation of stringers during the annealing process.
    Type: Application
    Filed: August 29, 2007
    Publication date: March 5, 2009
    Inventors: Steven Mark Buchoff, Andrew Christian Loyd, Robert S. Howell