Patents by Inventor Steven Masami Aragaki

Steven Masami Aragaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
    Patent number: 8114775
    Abstract: A chemical mechanical polishing composition contains 1) water, 2) optionally an abrasive material, 3) an oxidizer, preferably a per-type oxidizer, 4) a small amount of soluble metal-ion oxidizer/polishing accelerator, a metal-ion polishing accelerator bound to particles such as to abrasive particles, or both; and 5) at least one of the group selected from a) a small amount of a chelator, b) a small amount of a dihydroxy enolic compound, and c) a small amount of an organic accelerator. Ascorbic acid in an amount less than 800 ppm, preferably between about 100 ppm and 500 ppm, is the preferred dihydroxy enolic compound. The polishing compositions and processes are useful for substantially all metals and metallic compounds found in integrated circuits, but is particularly useful for tungsten.
    Type: Grant
    Filed: January 13, 2009
    Date of Patent: February 14, 2012
    Assignee: DuPont Air Products Nanomaterials, LLC
    Inventors: Junaid Ahmed Siddiqui, Daniel Hernandez Castillo, Steven Masami Aragaki, Robin Edward Richards
  • Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers
    Patent number: 7476620
    Abstract: A chemical mechanical polishing composition contains 1) water, 2) optionally an abrasive material, 3) an oxidizer, preferably a per-type oxidizer, 4) a small amount of soluble metal-ion oxidizer/polishing accelerator, a metal-ion polishing accelerator bound to particles such as to abrasive particles, or both; and 5) at least one of the group selected from a) a small amount of a chelator, b) a small amount of a dihydroxy enolic compound, and c) a small amount of an organic accelerator. Ascorbic acid in an amount less than 800 ppm, preferably between about 100 ppm and 500 ppm, is the preferred dihydroxy enolic compound. The polishing compositions and processes are useful for substantially all metals and metallic compounds found in integrated circuits, but is particularly useful for tungsten.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: January 13, 2009
    Assignee: DuPont Air Products NanoMaterials LLC
    Inventors: Junaid Ahmed Siddiqui, Daniel Hernandez Castillo, Steven Masami Aragaki, Robin Edward Richards