Patents by Inventor Steven Matthew Rich

Steven Matthew Rich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus and method for thin wafer transfer
    Patent number: 9349643
    Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.
    Type: Grant
    Filed: March 28, 2014
    Date of Patent: May 24, 2016
    Assignee: Brewer Science Inc.
    Inventors: Blake Waterworth, Steven Matthew Rich, Molly Hladik, Kirk Emory
  • APPARATUS AND METHOD FOR THIN WAFER TRANSFER
    Publication number: 20140295656
    Abstract: A wafer transfer assembly and method of using the assembly to transfer device wafers between processing tools in a manufacturing process are described herein. The assembly comprises a wafer transfer disk, an end effector configured to receive and support the wafer transfer disk, and an elongated handle extending from the end effector. The wafer transfer disk comprises a wafer-engaging surface configured to support a debonded device wafer placed on the wafer transfer assembly with the device surface adjacent the wafer-engaging surface. The wafer-engaging surface has non-stick properties, and yields a low bonding strength interface between the wafer-engaging surface and device surface. The resulting transfer stack can be transported to other processing tools for additional processing of the debonded device wafer, followed by separating the debonded device wafer and the wafer transfer disk without damaging the device wafer.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 2, 2014
    Applicant: Brewer Science Inc.
    Inventors: Blake Waterworth, Steven Matthew Rich, Molly Hladik, Kirk Emory