Abstract: A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by masking and etching. Additional layers of conductive materials may be used to provide a barrier layer and a noble metal cap for the conductive elements. The methods of the present invention may be used to fabricate an interposer for use in packaging semiconductor devices or a test substrate. Substrate precursor structures are also disclosed.

Abstract: Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers a surface of the at least one aperture of the substrate blank. A mask pattern covers a portion of the at least one conductive layer and exposes another portion of the at least one conductive layer to define at least one conductive element, at least a portion of which extends over the surface of the at least one aperture.

Abstract: A new and distinctive variety of an apple tree, named ‘El Niño Gala,’ characterized by fruit color having intense dark red stripes over a bright red background.

Abstract: Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the lining material. The lining material is then fixed in place to form a layer lining the via. The lined via may then be filled with a desired material. For example, a via lined with an insulative material may be filled with a material such as copper to create an insulated conductive via through the substrate.

Abstract: Methods are provided for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the lining material. The lining material is then fixed in place to form a layer lining the via. The lined via may then be filled with a desired material. For example, a via lined with an insulative material may be filled with a material such as copper to create an insulated conductive via through the substrate.

Abstract: Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers a surface of the at least one aperture of the substrate blank. A mask pattern covers a portion of the at least one conductive layer and exposes another portion of the at least one conductive layer to define at least one conductive element, at least a portion of which extends over the surface of the at least one aperture.

Abstract: The invention includes methods by which a fuse box of a semiconductor construction is fabricated to have a substantially uniform layer over fuses extending therein. In particular aspects, the invention includes methods in which one or more processing steps associated with fabrication and patterning of bond pads and redistribution layers is conducted simultaneously over a fuse box region to form and/or remove materials that are directly over the fuse box region.

Abstract: Methods for detecting osteolysis are described. The diagnostic method involves detecting the presence of regulatory T cells in a sample from a patient.

Abstract: A gas/liquid mixing equipment of the present invention comprises a stirring vessel 1, a stirring shaft 10 inserted horizontally in the stirring vessel 1 and a helical ribbon impeller 20 attached to the stirring shaft 10, whereby a high gas absorption performance can be secured even with low shearing. Further, a polymer can be produced with high productivity. A gas/liquid mixing method of the present invention is a method which comprises employing the above-mentioned gas/liquid mixing equipment, and a method for producing a polymer of the present invention is a method which comprises polymerizing feed monomers containing gaseous monomers in aqueous solvents, wherein the gaseous monomers and the aqueous solvents are mixed by such a gas/liquid mixing method. A polymer of the present invention is produced by the above-mentioned method for producing a polymer.

Abstract: Methods for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the lining material. The lining material is then fixed in place to form a layer lining the via. The lined via may then be filled with a desired material. For example, a via lined with an insulative material may be filled with a material such as copper to create an insulated conductive via through the substrate.

Abstract: Methods for creating lined vias in semiconductor substrates. Using electrophoretic deposition techniques, micelles of a lining material are deposited on the wall of the via, reacting with the surface of the wall until the entire wall is covered by the lining material. The lining material is then fixed in place to form a layer lining the via. The lined via may then be filled with a desired material. For example, a via lined with an insulative material may be filled with a material such as copper to create an insulated conductive via through the substrate.

Abstract: An article of footwear is disclosed that includes an upper, an outsole, and a midsole. The upper is configured to receive a foot, and the outsole is secured to the upper. The outsole defines a plurality of apertures extending entirely through the outsole. In addition, the outsole has a ground-engaging surface positioned at a first elevation. The midsole is separate from the upper and the outsole. The midsole is also positionable within the upper such that a lower surface of the midsole extends into the apertures of the outsole and is exposed by the apertures. The lower surface is at a second elevation, the first elevation being less than the second elevation.

Abstract: An article of footwear is disclosed that includes an upper and a sole structure secured to the upper. The sole structure includes a connecting portion positioned adjacent the upper and extending along a longitudinal length of the upper. A plurality of discrete sole elements extend downward from the connecting portion. The sole elements define a lower surface, and the sole elements are separated by a plurality of sipes that extend upward from the lower surface and into the sole structure. An outsole may be located within the sipes and extend between the sole elements, with a lower portion of the outsole extending beyond the lower surface of the sole elements.

Abstract: The invention includes methods by which a fuse box of a semiconductor construction is fabricated to have a substantially uniform layer over fuses extending therein. In particular aspects, the invention includes methods in which one or more processing steps associated with fabrication and patterning of bond pads and redistribution layers is conducted simultaneously over a fuse box region to form and/or remove materials that are directly over the fuse box region.

Abstract: A method of fabricating a substrate is disclosed. Apertures are formed in a substrate blank. A conductive layer is formed on opposing surfaces of the substrate, as well as inside the apertures. Conductive elements are defined on one or both opposing surfaces by masking and etching. Additional layers of conductive materials may be used to provide a barrier layer and a noble metal cap for the conductive elements. The methods of the present invention may be used to fabricate an interposer for use in packaging semiconductor devices or a test substrate. Substrate precursor structures are also disclosed.

Abstract: A semiconductor component configured for wafer-level testing includes a semiconductor die having at least one die contact electrically exposed for coupling with a redistribution circuit that electrically couples at least one die contact to an extended contact such as a bumped contact. A wafer-level redistribution circuit interconnects a plurality of dice and includes a redistribution circuit for coupling between a die contact on one of the dice and a corresponding bumped contact. The wafer-level redistribution circuit further includes a bus conductor traversing each of the plurality of dice for electrically coupling with at least another one of the plurality of dice. At least one other conductor couples the redistribution circuit to the bus conductor.

Abstract: The invention relates to methods for improving the octane number of a synthetic naphtha stream and optionally for producing olefins and/or solvents. In one embodiment, the method comprises aromatizing at least a portion of a synthetic naphtha stream to produce an aromatized hydrocarbon stream; and isomerizing at least a portion of the aromatized hydrocarbon stream to produce an isomerized aromatized hydrocarbon stream having a higher octane rating than the synthetic naphtha stream. Alternatively, the method comprises providing at least three synthetic naphtha cuts comprising a C4-C5 stream; a C6-C8 stream and a C9-C11 stream; aromatizing some of the C6-C8 stream to form an aromatized hydrocarbon stream with a higher octane number; steam cracking some of the C6-C8 stream and optionally the C9-C11 stream to form olefins; and selling some portions of C9-C11 stream as solvents. In preferred embodiments, the synthetic naphtha is derived from Fischer-Tropsch synthesis.

Abstract: The invention relates to a reactor comprising two reaction zones and processes for the production of alkenes from alkanes. A first reaction zone includes a combustion catalyst, and a second reaction zone comprises a heating zone in thermal contact with the first reaction zone. One process comprises generating heat and an effluent by the combustion of a fuel with oxygen in the first reaction zone; passing an alkane feed through the heating zone of the second reaction zone such that the alkane feed absorbs a sufficient amount of the heat generated in the first reaction zone to initiate the conversion of alkanes to alkenes in the second reaction zone. In other embodiments, the effluent comprises oxygen, and the second reaction zone excludes a catalyst; alternatively, the effluent is substantially free of oxygen, and the second reaction zone comprises a supplemental oxygen feed and may or may not include a catalyst.

Abstract: A method for producing olefins by oxidative dehydrogenation. In one embodiment, the method comprises feeding a feed to a reactor comprising a catalyst, wherein the feed comprises oxygen, and a carbonaceous material comprising carbon monoxide and a light hydrocarbon; contacting the feed to the catalyst in the reactor; and converting at least a portion of the light hydrocarbon with oxygen to at least one olefin, while simultaneously converting at least a portion of the carbonaceous material with oxygen to carbon dioxide to form a product stream comprising the at least one olefin and by-products. The by-products comprise at least carbon monoxide. In other embodiments, at least a portion of the by-products, which comprise carbon monoxide, is recycled to the reactor. In further embodiments, the light hydrocarbon feed comprises ethane, and the olefin comprises ethylene.

Abstract: A new and distinctive variety of an apple tree, named ‘El Niño’ characterized by fruit color having intense dark red stripes over a bright red background.