Abstract: An improved method and apparatus for encapsulation of splices, connections, and repairs of wires, tubes, hoses, and similar conductors. Encapsulation is accomplished by securing the area to be encapsulated in a mold set and injecting a hot-melt sealant. Further embodiments allow for the addition of mounting lugs or tabs to the encapsulation for the purpose of mounting or identification. Method can also be used to mold mounting lugs or identification tabs over uninterrupted portions of the aforementioned conductors. The method provides superior resistance to ingress of contaminants and provides strain relief of encapsulated areas by supporting the conductors to reduce movement. The adhesive nature of the sealant reduces the likelihood of conductors being pulled apart.