Abstract: A system for providing a quick response (QR) Code® associated with an injection system is disclosed. The system includes the injection system and at least one processor. The at least one processor is programmed or configured to: receive data associated with the injection system; generate a network resource based on the data associated with the injection system, wherein, when generating the network resource, the at least one processor is programmed or configured to encode the data associated with the injection system into the network resource; generate a QR Code® based on the network resource; and display the QR Code® on a display screen of the injection system.

Abstract: A system for providing a quick response (QR) code associated with an injection system is disclosed. The system includes the injection system and at least one processor. The at least one processor is programmed or configured to: receive data associated with the injection system; generate a network resource based on the data associated with the injection system, wherein, when generating the network resource, the at least one processor is programmed or configured to encode the data associated with the injection system into the network resource; generate a QR code based on the network resource; and display the QR code on a display screen of the injection system.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A packaged electrical device that includes a cured adhesive layer and a cured layer of die attach material coupled between a semiconductor die and a substrate. The packaged electrical device may also include wire bonds coupled between the substrate and leads of the semiconductor die. In addition, the packaged electrical device may be encapsulated in molding compound. A method for fabricating a packaged electrical device. The method includes printing a layer of die attach material over a semiconductor wafer and applying a layer of 2-in-1 die attach film over the layer of die attach material. The method also includes singulating the semiconductor wafer to create a semiconductor die and placing the semiconductor die onto a substrate. In addition the method includes wire bonding the substrate to leads of the semiconductor die and encapsulating the device in molding compound.

Abstract: A transformer core apparatus includes a body of highly magnetically permeable material, a permanent magnet arranged in a safe state position for saturating the body with a permanent magnetic field, and means for removing the permanent magnetic field from the body.

Abstract: Various methods and systems are provided for a crossing equipment controller. In one embodiment, a method comprises prior to a vehicle entering a diverging zone, calculating a travel time until the vehicle at a determined position would reach a crossing based on one or more vehicle conditions, and in response to the vehicle entering the diverging zone, updating the travel time with a time-based countdown.

Abstract: A transformer core apparatus includes a body of highly magnetically permeable material, a permanent magnet arranged in a safe state position for saturating the body with a permanent magnetic field, and means for removing the permanent magnetic field from the body.

Abstract: Various methods and systems are provided for a crossing equipment controller. In one embodiment, a method comprises prior to a vehicle entering a diverging zone, calculating a travel time until the vehicle at a determined position would reach a crossing based on one or more vehicle conditions, and in response to the vehicle entering the diverging zone, updating the travel time with a time-based countdown.

Abstract: An apparatus (10) for contactless measurement of sheet charge density and mobility includes a microwave source (16), a circular waveguide (50) for transmitting microwave power to a sample (59), such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector (18) for detecting the forward microwave power, a second detector (23) for detecting the microwave power reflected from the sample, and a third detector (95) for detecting the Hall effect power. An automatic positioning subsystem (700) is also provided for allowing automatic positioning of a wafer (59) within the test apparatus (10). The positioning system (700) includes a first end effector (706) and a rotator-lifter (704).

Abstract: An apparatus for testing of electrical or physical properties of a material include a single coil sensor mounted adjacent to a sample of the material. Sheet conductance of a wide variety of materials may be measured using the single coil to determine if the material conforms to generally accepted standards for the use to which the material will be put. In some examples, the material is a semiconductor wafer or flat panel. In other examples, the material is the body tissue of a patient. A non-invasive technique using the apparatus is also disclosed for monitoring the health of patient tissue such as musculature, and/or to determine whether healthy circulation is present, by measuring the conductance of the patient tissue in response to a magnetic field applied by the single coil. The single coil may be hand held, or it may be movable using an automated positioning system under computer control.

Abstract: A probe card assembly comprises multiple probe substrates attached to a mounting assembly. Each probe substrate includes a set of probes, and together, the sets of probes on each probe substrate compose an array of probes for contacting a device to be tested. Adjustment mechanisms are configured to impart forces to each probe substrate to move individually each substrate with respect to the mounting assembly. The adjustment mechanisms may translate each probe substrate in an “x,” “y,” and/or “z” direction and may further rotate each probe substrate about any one or more of the forgoing directions. The adjustment mechanisms may further change a shape of one or more of the probe substrates. The probes can thus be aligned and/or planarized with respect to contacts on the device to be tested.

Abstract: An apparatus for contactless measurement of sheet charge density and mobility includes a microwave source, a circular waveguide for transmitting microwave power to a sample, such as a semiconductor wafer or panel for flat panel displays, at a measurement location, a first detector for detecting the forward microwave power, a second detector for detecting the microwave power reflected from the sample, and a third detector for detecting the Hall effect power. A circular waveguide, carrying only the TE11 mode, is terminated by the sample behind which an short circuit is located. Perpendicular to the plane of the sample (and along the axis of the circular waveguide), a magnetic field is applied. In this configuration, a given incident TE11 wave will cause two reflected waves. One is the ordinary reflected wave in the same polarization as the incident one. A detector is provided to measure this reflected power. The other reflected wave is caused by the Hall effect.

Abstract: The unique design of Magnum Bullet Darts, “being constructed with actual firearm cartridge components of all types and sizes, as a dart, and the fact that they have two (2) different shaft application design options, which includes the only dart with a self-contained sliding adjustable shaft, for the user's option,” makes it obvious, what is new over the prior art that it pertains to.

Abstract: This invention relates to a recombinant nucleic acid vector comprising a first expression cassette comprising a first promoter operably linked to a nucleic acid sequence encoding a syncytium-inducing polypeptide, wherein the first expression cassette is flanked on either side by a site recognized by a recombinase. The invention also includes a second expression cassette comprising a tissue-specific promoter operably linked to a nucleic acid sequence encoding a recombinase. The invention also includes cells and compositions including these expression cassettes and methods of reducing tumor volume by expression of these expression cassettes.