Patents by Inventor Steven O. Dunford
Steven O. Dunford has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230381863Abstract: A method of forming electronic substrates and assemblies is provided. The method includes forming a first layer, including co-depositing a first material and a second material, where the first material and the second material are co-deposited as powders, binders, slurries, inks, or combinations thereof, and at least partially sintering or curing the first layer of co-deposited materials. Further, the method includes forming a second layer, including co-depositing the first material and the second material, and at least partially sintering or curing the second layer of co-deposited materials. Additionally, the method includes retrieving a solid electronic substrate wherein the sintered or cured first material of the first layer forms the solid electronic substrate and the sintered or cured second material of the first layer forms a feature in or on the solid electronic substrate.Type: ApplicationFiled: August 11, 2023Publication date: November 30, 2023Inventors: Steven O. Dunford, Mark Kostinovsky
-
Patent number: 11770906Abstract: The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.Type: GrantFiled: August 27, 2021Date of Patent: September 26, 2023Assignee: SCHLUMBERGER TECHNOLOGY CORPORATIONInventors: John Michael Beshears, Steven O. Dunford
-
Patent number: 11765839Abstract: A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.Type: GrantFiled: October 10, 2018Date of Patent: September 19, 2023Assignee: SCHLUMBERGER TECHNOLOGY CORPORATIONInventors: Steven O. Dunford, Mark Kostinovsky, Lweness Mazari
-
Patent number: 11676926Abstract: A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.Type: GrantFiled: August 24, 2020Date of Patent: June 13, 2023Assignee: Schlumberger Technology CorporationInventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
-
Publication number: 20230069147Abstract: The disclosure provides for methods of making electrically conductive apparatus, such as circuit boards. The methods include 3D-printing a ceramic material into a ceramic substrate that includes a void. A conductive material is infused into the void. The conductive materiel forms electrically conductive connections within the apparatus. Also disclosed are apparatus formed by the methods.Type: ApplicationFiled: August 27, 2021Publication date: March 2, 2023Inventors: John Michael Beshears, Steven O. Dunford
-
Patent number: 11329023Abstract: A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.Type: GrantFiled: August 24, 2020Date of Patent: May 10, 2022Assignee: Schlumberger Technology CorporationInventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
-
Publication number: 20220059489Abstract: A method for interconnecting two conductors includes creating a first nickel layer on a first conductor of an electrical component, producing a first non-gold protective layer on the first nickel layer, the first non-gold protective layer being configured to prevent the first nickel layer from oxidizing, creating a second nickel layer on a second conductor, producing a second non-gold protective layer on the second nickel layer, the second non-gold protective layer being configured to prevent the second nickel layer from oxidizing, and interconnecting the first and second nickel layers using a solder layer that interfaces with the first and second nickel layers between the first and second conductors.Type: ApplicationFiled: August 24, 2020Publication date: February 24, 2022Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
-
Publication number: 20210320082Abstract: A method for interconnecting a first conductor and a second conductor includes forming a layer of substantially pure copper on the first conductor, applying a copper sintering material to the first conductor, the second conductor, or both, and interconnecting the first conductor and the second conductor by sintering the copper sintering material so as to form a copper-copper interface that includes the layer of substantially pure copper, the second conductor, and the copper sintering material.Type: ApplicationFiled: August 24, 2020Publication date: October 14, 2021Inventors: Mark Alex Kostinovsky, Steven O. Dunford, Lweness Mazari
-
Publication number: 20200120813Abstract: A method of forming electronic substrates and assemblies is provided. The method includes depositing a material. The material is deposited as a powder or slurry. The method includes sintering the material, and retrieving an article, including a solid electronic substrate. Also provided are electronic substrates formed by additive manufacturing, and methods of deploying the same.Type: ApplicationFiled: October 10, 2018Publication date: April 16, 2020Inventors: Steven O. Dunford, Mark Kostinovsky, Suriyakan Kleitz, Man To, Lweness Mazari
-
Patent number: 7881068Abstract: Provided herein is a composite layer including an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The composite layer includes a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the composite layer provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.Type: GrantFiled: January 15, 2009Date of Patent: February 1, 2011Assignee: Nokia CorporationInventors: Ramin Vatanparast, Mikko Aarras, Steven O. Dunford, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen, Jukka I. Rantala, Pia Tanskanen, Tetsuya Yamamoto
-
Publication number: 20100252034Abstract: The present invention provides for a breathing device comprising a housing, oxygen source, water trap, activation mechanism, and breathing apparatus. Operation of the activation mechanism may commence the production of a gas comprising oxygen. The generated oxygen may be bubbled through the water trap prior to being provided to the breathing apparatus attached to the user. Some embodiments may comprise two separate oxygen sources configured to provide distinct flow rates from one another. Other embodiments may comprise a rotating catalyst container configured to evenly and rapidly distribute catalyst upon commencement of the oxygen production. Still other embodiments may comprise a convoluted section of tubing to aid in altering the temperature of the produced oxygen gas.Type: ApplicationFiled: January 16, 2007Publication date: October 7, 2010Inventors: Julian T. Ross, Steven O. Dunford, Kraig Kooiman, John Lansdown, Kathleen Vaughn, Scott Freeman, Brian Highley, Kevin J. Turner, Michael T. Wright
-
Publication number: 20100010421Abstract: The present invention provides an applicator for directing a flow of medically pure, therapeutic gas onto a selected portion of the body of a patient. The applicator receives the flow of medically pure, therapeutic gas, such as oxygen, from a source, via a conduit coupled to the source and to the applicator. The applicator can be an adhesive bandage having an inlet for receiving the flow of gas, and one or more outlets for directing the flow of gas. The applicator can also be a mask, patch or similar article configured to be applied to the skin of a patient and connected to a source of medically pure, therapeutic gas via a conduit. The applicator can also having other therapeutic materials impregnated therein. The applicator can also be configured to deliver other therapeutic substances introduced into the flow of gas.Type: ApplicationFiled: July 8, 2008Publication date: January 14, 2010Applicant: OxySure Systems Inc.Inventors: Julian T. Ross, Steven O. Dunford
-
Publication number: 20090120672Abstract: A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.Type: ApplicationFiled: January 15, 2009Publication date: May 14, 2009Inventors: Ramin Vatanparast, Mikko Aarras, Steven O. Dunford, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen, Jukka I. Rantala, Pia Tanskanen, Tetsuya Yamamoto
-
Patent number: 7523546Abstract: A method is provided for manufacturing an electronically functional structural component adapted to integrate a plurality of electronic functions into a laminate cover, layer, and/or laminate component, for protecting, supporting, and/or forming a complete electronic device (such as a multimedia device). The method includes laminating a plurality of structural and/or protective layers interspersed with electronically functional layers or electronic components in communication with the multimedia device to form a supportive and electronically functional layer, cover, protective layer, and/or electronic device. Thus, the manufacturing methods provided allow for the cost-effective addition of thin and lightweight functional, protective, and/or decorative layers to a multimedia device or other electronic device at a sales location or other customization location.Type: GrantFiled: May 4, 2005Date of Patent: April 28, 2009Assignee: Nokia CorporationInventors: Ramin Vatanparast, Mikko Aarras, Steven O. Dunford, Takaharu Fujii, Juhani Lainonen, Jaakko Nousiainen, Jukka I. Rantala, Pia Tanskanen, Tetsuya Yamamoto
-
Publication number: 20090081115Abstract: Various disclosures of an oxygen generator apparatus and methods of using such are disclosed.Type: ApplicationFiled: June 25, 2008Publication date: March 26, 2009Applicant: OxySure Systems Inc.Inventors: Julian T. Ross, Steven O. Dunford, Scott Freeman, Steven Johnson, Tomas Cervenka, Martin Wieting
-
Publication number: 20090076475Abstract: The present invention provides an applicator for directing a flow of medically pure, therapeutic gas onto a selected portion of the body of a patient. The applicator receives the flow of medically pure, therapeutic gas, such as oxygen, from a source, via a conduit coupled to the source and to the applicator. The applicator can be an adhesive bandage having an inlet for receiving the flow of gas, and one or more outlets for directing the flow of gas. The applicator can also be a mask, patch or similar article configured to be applied to the skin of a patient and connected to a source of medically pure, therapeutic gas via a conduit. The applicator can also having other therapeutic materials impregnated therein. The applicator can also be configured to deliver other therapeutic substances introduced into the flow of gas.Type: ApplicationFiled: November 9, 2006Publication date: March 19, 2009Applicant: OxySure Systems Inc.Inventors: Julian T. Ross, Steven O. Dunford
-
Patent number: 6802119Abstract: A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and embedding the pedestals into the solder columns which are used to provide electrical connection. The conductive pedestals are comprised of an electrically conducting metal, solder, alloy or composite which will also provide thermal dissipation in selected designs.Type: GrantFiled: September 4, 2002Date of Patent: October 12, 2004Assignee: Texas Instruments IncorporatedInventor: Steven O. Dunford
-
Publication number: 20030008434Abstract: A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and embedding the pedestals into the solder columns which are used to provide electrical connection. The conductive pedestals are comprised of an electrically conducting metal, solder, alloy or composite which will also provide thermal dissipation in selected designs.Type: ApplicationFiled: September 4, 2002Publication date: January 9, 2003Inventor: Steven O. Dunford
-
Patent number: 6472611Abstract: A device and method for insuring the separation between a leadless chip carrier and printed wiring board, comprising aligning and attaching conductive pedestals to contact pads of either member and embedding the pedestals into the solder columns which are used to provide electrical connection. The conductive pedestals are comprised of an electrically conducting metal, solder, alloy or composite which will also provide thermal dissipation in selected designs.Type: GrantFiled: January 13, 1999Date of Patent: October 29, 2002Assignee: Texax Instruments IncorporatedInventor: Steven O. Dunford
-
Patent number: D615186Type: GrantFiled: June 25, 2008Date of Patent: May 4, 2010Assignee: Oxysure Systems, Inc.Inventors: Julian T. Ross, Steven O. Dunford, Scott Freeman, Steven Johnson, Tomas Cervenka, Martin Wieting