Patents by Inventor Steven P. Cooper

Steven P. Cooper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing particulate contamination during polishing of a wafer
    Patent number: 6849548
    Abstract: A method of polishing the surface of a semiconductor wafer such that the adherence of abrasive particles to the surface of the wafer is minimized, resulting in a semiconductor wafer having a reduced number of pits. The invented method has two stages. The first stage follows traditional polishing practice using chemical mechanical polishing. The second stage diverges from traditional practices and provides for a final polishing step or steps involving the polishing of the wafer with a polishing solution having no abrasive particles.
    Type: Grant
    Filed: April 5, 2002
    Date of Patent: February 1, 2005
    Assignee: SEH America, Inc.
    Inventor: Steven P. Cooper
  • Method of reducing particulate contamination during polishing of a wafer
    Publication number: 20030190810
    Abstract: A method of polishing the surface of a semiconductor wafer such that the adherence of abrasive particles to the surface of the wafer is minimized, resulting in a semiconductor wafer having a reduced number of pits. The invented method has two stages. The first stage follows traditional polishing practice using chemical mechanical polishing. The second stage diverges from traditional practices and provides for a final polishing step or steps involving the polishing of the wafer with a polishing solution having no abrasive particles.
    Type: Application
    Filed: April 5, 2002
    Publication date: October 9, 2003
    Applicant: SEH America, Inc.
    Inventor: Steven P. Cooper
  • Processes for polishing wafers
    Publication number: 20020175143
    Abstract: Processes for polishing acid etched wafers include contacting wafers, such as a silicon wafers, with an aqueous hydrogen peroxide solution, and then polishing the wafers with an aqueous alkaline slurry. The processes can prevent edge stain by forming a passivation layer on the wafers.
    Type: Application
    Filed: May 22, 2001
    Publication date: November 28, 2002
    Applicant: SEH AMERICA, INC.
    Inventor: Steven P. Cooper
  • Use of H.sub.2 O.sub.2 solution as a method of post lap cleaning
    Patent number: 6063205
    Abstract: A method for post lapping cleaning of silicon wafers wherein the lapped wafer surfaces are cleaned and passivated by being treated with an aqueous hydrogen peroxide solution of about 0.5 to 2% by weight of hydrogen peroxide and then dried.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: May 16, 2000
    Inventors: Steven P. Cooper, Michito Sato