Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene or alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

Abstract: A process for the epoxidation of olefins comprises contacting the olefin with urea-hydrogen peroxide in the presence of a rhenium oxide catalyst in an organic solvent.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkyleneoxy repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities.

Abstract: A process for the epoxidation of olefins comprises contacting the olefin with bis(trimethylsilyl)peroxide in the presence of a rhenium catalyst in an organic solvent.

Abstract: Novel polyimide and polyisoimide oligomers and precursors thereof, end-capped with diaryl substituted acetylene.These novel end-capped polyimide or polyisoimides oligomers are useful for composites, molding compounds, adhesives, and electronic applications.

Abstract: A class of fluorinated phenylethynylaniline compounds is disclosed, said compounds having a use as capping reagents in high temperature stable polyimides or other polymers having a functionality which can undergo reaction with the amine to form a stable adduct. The diamine compounds of the invention are useful as step-growth monomers in the preparation of polymers containing reactive acetylene groups in the polymer backbone.

Abstract: A multi-step process for the preparation of ethynylbenzaldehydes from bromo- or iodobenzaldehydes is disclosed. The arylhalogen is replaced with a protected ethynyl compound which is subsequently cleaved by base to form the arylacetylene. The aldehydic functionlity is preserved by formation of a corresponding Schiff's base or acetal, and its subsequent regeneration by treatment with aqueous acid.

Abstract: A multi-step process for the preparation of ethynylbenzaldehydes from bromo- or iodobenzaldehydes is disclosed. The arylhalogen is replaced with a protected ethynyl compound which is subsequently cleaved by base to form the arylacetylene. The aldehydic functionality is preserved by formation of a corresponding Schiff's base or acetal, and its subsequent regeneration by treatment with aqueous acid.

Abstract: Novel mono- or difunctional phenylacetylene-substituted Schiff's base monomers useful in the preparation of electrically conducting polymers is disclosed. On heating, these monomers melt to a viscous liquid state, and on continued heating above about 300.degree. C. polymerize to form an electrically insulating thermoset polymer. On further post-cure heat treatment, the polymer becomes electroconductive showing a bulk conductivity of at least 10.sup.-2 S/cm.