Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

Abstract: An improved method to enhance the comfort of a typical chair, which includes: (1) A radio mounted into arm of chair, (2) a speaker connection line to speakers mounted on either side of top portion of chair, (3) A optional sound bar that carries sound from speakers through frame of chair to top portion where release of sound is desired.

Abstract: An improved apparatus for treating plate-like workpieces with a designated chemical solution, including printed circuit boards, includes: (1) a tray for holding the chemical solution, with the tray having an open top which is configured to receive a horizontally-oriented workpiece, with the tray having a top edge with a portion of the edge forming a dam over which the solution may flow and an opening in its lower portion where the solution can enter the tray, (2) a reservoir tank situated below the tray, (3) a feed line connecting the reservoir tank and tray opening, (4) a drain that returns the solution that overflows the tray top edge to the reservoir tank, and (5) a pump that circulates the solution from the tank to the tray and over the horizontally situated workpiece.

Abstract: A method and apparatus for processing a panel stack having one or more panels are provided. The panel stack is provided with at least one through hole. Fluid or gas may be passed through the through hole. By inhibiting the contact of the fluid or gas from the flat surfaces of the panels, processing of the through holes can be accomplished with reduced resources and more quickly. Panel stacks can include one to at least hundreds of panels. Various applications include electroless copper deposition, electroplating of copper for a printed circuit board, chemical etchback or desmear, honing of the through hole wall using a slurry of pumice as a replacement for chemical etchback or desmear, chemical microetching of a through hole wall, and through hole blasting with pressurized water or air to clean away any debris.

Abstract: An apparatus for spraying electroplating of metal onto a panel surface that moves through a plating chamber employs roller brushes positioned between electrolyte spray heads and the panel. Metal anodes are positioned to contact the fluffy, absorbent outer layer of the roller brushes while they are being wet by the electrolyte to provide for electrical contact between the anodes and the panel being plated. A suitable power supply has its positive terminal connected to the anodes and its negative terminal connected to the moving panel.