Abstract: A method for forming a heat transfer apparatus wherein a conduit construct is formed between first and second construct ends and is disposed in a mold cavity with the first and second ends extending from the cavity, air is removed from the construct, body material in molten fluid form is provided in the cavity so as to cover the construct and the molten material is permitted to solidify. In addition, the invention includes a manganese/nickel barrier material which is placed on a conduit construct prior to introducing molten material into the cavity to reduce bubbles in the sink. The invention also includes a system for maintaining heat sink temperature despite fluctuating amount of heat generated by devices mounted to or adjacent a sink wherein the system includes a temperature sensor, a controller and a regulator, the controller controlling the regulator as a function of feedback signals received from the sensor.

Abstract: A heat sink apparatus including a fluid conduit within a body portion wherein the body portion including at least one body member linked to the fluid conduit and forming at least first and second walls which are in different planes, the walls forming at least a first mounting surface for mounting heat generating devices.

Abstract: A heat sink apparatus and method for making the same including a metallic main body portion and a hollow metallic fluid conduit assembly disposed within the main body portion and a binder material disposed between the assembly and the main body portion wherein the binder material prohibits alloying between the materials used to form each of the assembly and the body portion. The invention includes a supporter for maintaining the tube conduit position, both laterally and vertically during formation.

Abstract: A heat sink apparatus including a fluid conduit within a body portion wherein the body portion includes at least first and second walls which are in different planes, each wall forming at least one mounting surface, the conduit passing though each wall and, the apparatus also including at least two electronic devices, at least one device mounted to each of the mounting surfaces for dissipating heat, the assembly having a relatively small volume.

Abstract: A curved low impedance laminated bus assembly includes a curved first sheet of relatively thin conductive material forming an AC bus conductor and a curved second sheet of relatively thin conductive material forming a -DC bus conductor directly connected to a -DC line side of a DC energy storage device. A curved third sheet of relatively thin conductive material forms a +DC bus conductor directly connected to a +DC line side of the DC energy storage device and is connected to the AC bus conductor through a +DC switch. A plurality of dielectric sheets are laminated between the AC bus conductor, the -DC bus conductor, and the +DC bus conductor.